Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
24.10.2019 12:00:00 EEST | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP). The announcement was made as part of the company’s annual Samsung Tech Day at its Device Solutions’ America headquarters in San Jose, California.
"Leveraging our leading-edge 24-gigabit (Gb) LPDDR4X chips, we can offer the highest mobile DRAM capacity of 12GB not only for high-end smartphones but also for mid-range devices," said Sewon Chun, executive vice president of Memory Marketing at Samsung Electronics. "Samsung will continue to support our smartphone-manufacturing customers with on-time development of next-generation mobile memory solutions, bringing enhanced smartphone experiences to many more users around the globe."
Samsung is introducing its 12GB uMCP solution just seven months after its launch of a 12GB LPDDRX package based on 16Gb DRAM. By combining four of the 24Gb LPDDR4X chips (featuring the latest 1y-nanometer process technology) and ultra-fast eUFS 3.0 NAND storage into a single package, the new mobile memory is able to break through the current 8GB package limit and provide 10+ GB memory to the broader smartphone market.*
As the trend toward larger, higher-resolution smartphone displays continues to grow, more users will benefit from Samsung's uMCP solution when running data-intensive tasks or multitasking. With 1.5X capacity of the previous 8GB package and a data transfer rate of 4,266 megabits per second (Mbps), the 12GB uMCP can support smooth 4K video recording as well as accommodate AI and machine learning features even for mid-end smartphones.
Samsung plans to rapidly expand the availability of 10+ GB LPDDR DRAM to address the increasing needs of global smartphone makers for higher-capacity memory solutions, while reinforcing its competitive edge in the memory marketplace.
###
* Editors’ note:
12GB LPDDR4X uMCP: four 24Gb (3GB) chips + eUFS 3.0
10GB LPDDR4X uMCP: two 24Gb (3GB) chips + two 16Gb (2GB) chips + eUFS 3.0
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20191024005056/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)6196-66-3300
Email:
ujeong.j@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
The Estée Lauder Companies Announces Expanded Roles for Brian Franz and Amber English9.9.2026 00:05:00 EEST | Press release
The Estée Lauder Companies Inc. (NYSE: EL) today announced expanded leadership roles for two members of its Executive Team. Brian Franz has been appointed Chief Technology & Transformation Officer,expanding his responsibilities to include leading the company's enterprise-wide transformation. Amber English has been named President, Digital & Online, The Americas and Global Amazon Lead, assuming new enterprise-wide responsibility for The Estée Lauder Companies’ global relationship with Amazon. Both will continue to report directly to Stéphane de La Faverie, President and Chief Executive Officer, and remain members of The Estée Lauder Companies’ Executive Team. Both appointments are effective immediately. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260908417554/en/ Brian Franz, Chief Technology & Transformation Officer, and Amber English, President, Digital & Online, The Americas and Global Amazon Lead “Transformation at The
Samsung and Mistral AI Announce Strategic Partnership for Intelligence-Driven Semiconductor Infrastructure8.9.2026 19:15:00 EEST | Press release
Samsung Electronics Co., Ltd., today announced it has entered into a strategic partnership with Mistral AI to enhance its semiconductor engineering and manufacturing capabilities that will reinforce its leadership in AI chip technologies. The announcement of the partnership was made during the state summit held in Paris between South Korea and France. Under the agreement, Samsung will integrate Mistral’s AI services and solutions—including its flagship large language model, Mistral Large—across its semiconductor operations to develop customized on-premises AI models optimized for intelligence-driven infrastructure. Mistral’s powerful AI platform is expected to provide Samsung with a unique stack of tools that will transform how semiconductors are designed and manufactured. The on-premises enterprise solutions will especially ensure security and flexibility required to process highly sensitive technologies and operational data entirely within the boundaries of Samsung’s semiconductor in
Sensereo Airo Wins IFA Berlin Innovation Award8.9.2026 18:00:00 EEST | Press release
Sensereo, an environmental intelligence company developing next-generation sensing products for safer, healthier and smarter living, was presented with the prestigious IFA Berlin Innovation Award for its Airo modular indoor air quality system. The award was presented during IFA Berlin on Thursday, Sept. 4, recognizing Airo for its innovative approach to helping consumers better understand and manage the quality of their indoor environments. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260906292649/en/ Winner of a 2026 IFA Innovation Award, Airo is Sensereo’s flagship environmental intelligence platform, combining advanced sensing technology with a modular design that allows users to monitor multiple aspects of indoor air quality and environmental conditions through a single, consumer-friendly system. Designed to transform complex environmental data into useful, actionable information, Airo helps households better understan
Verdantis Rebrands as the AI Super-Agent for MRO, Sets Sights on AI-Native Enterprise Asset Management8.9.2026 17:06:00 EEST | Press release
Verdantis, the AI company for spare parts and MRO inventory optimization in asset-intensive industries, today unveiled its new brand identity as the AI Super-agent for MRO and announced it is building toward a fully AI-native Enterprise Asset Management (EAM) platform. Verdantis’s super-agent orchestrates nine specialized AI agents across the decisions that decide plant uptime: spare parts, criticality, demand, reorder, and work order planning. These decisions set working capital, maintenance spend, and whether a critical asset runs and, in most plants, they are still made in spreadsheets and disconnected systems. The positioning is for the teams who own uptime - maintenance, reliability, and MRO supply chain leaders in oil and gas, mining, utilities, chemicals, and manufacturing. And it reflects an AI-first architecture: agents decide and act by default; people supervise, override, and teach the system. Every human override creates feedback that helps the system learn. That principle
HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem8.9.2026 17:00:00 EEST | Press release
HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced that VentureTech Alliance ("VTA") has joined its Series C financing round. VTA is a venture investment firm focused on the semiconductor industry, with a portfolio built across the semiconductor technology stack — including circuit design, foundry-adjacent process technology, EDA, advanced packaging, and photonics. VTA's participation extends the ecosystem alignment that defined the round, which brought together investors spanning silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure capital. With VTA's addition, the syndicate now reaches further into the semiconductor manufacturing and design-enablement layers on which high-volume photonics production depends. "The transition to TFLN is not a component decision — it is an ecosystem decision," said Mian Zhang, CEO of HyperLight. "Getting TFLN into volume requires the proc
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom