Business Wire

Samsung Electronics’ Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform

Share

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its ongoing commitment to foundry innovation and service at the Samsung Foundry Forum 2019 USA, providing the silicon community with wide-ranging updates on technology advances that support the most demanding applications of today and tomorrow.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190515005318/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Evolution of Transistor Archtecture_MBCFET (Photo: Business Wire)

The event, held today in Santa Clara, California, features top Samsung executives and industry experts reviewing progress on semiconductor technologies and foundry platform solutions that enable developments in artificial intelligence (AI), machine learning, 5G networking, automotive, the Internet of Things (IoT), advanced data centers and many other domains.

“We stand at the verge of the Fourth Industrial Revolution, a new era of high-performance computing and connectivity that will advance the daily lives of everyone on the planet,” said Dr. ES Jung, President and head of Foundry Business at Samsung Electronics.

“Samsung Electronics fully understands that achieving powerful and reliable silicon solutions requires not only the most advanced manufacturing and packaging processes as well as design solutions, but also collaborative foundry-customer relationships grounded on trust and shared vision. This year’s Foundry Forum is filled with compelling evidence of our commitment to progress in all those areas, and we’re honored to host and converse with our industry’s best and brightest,” Dr. Jung added.

Highlights from the U.S. Foundry Forum include:

The new 3nm GAE PDK version 0.1 is ready

Samsung’s 3nm Gate-All-Around (GAA) process, 3GAE, development is on track. The company noted today that its Process Design Kit (PDK) version 0.1 for 3GAE has been released in April to help customers get an early start on the design work and enable improved design competitiveness along with reduced turnaround time (TAT).

Compared to 7nm technology, Samsung’s 3GAE process is designed to provide up to a 45 percent reduction in chip area with 50 percent lower power consumption or 35 percent higher performance. The GAA-based process node is expected to be widely adopted in next-generation applications, such as mobile, network, automotive, Artificial Intelligence (AI) and IoT.

Conventional GAA based on nanowire requires a larger number of stacks due to its small effective channel width. On the other hand, Samsung’s patented version of GAA, MBCFET™ (Multi-Bridge-Channel FET), uses a nanosheet architecture, enabling greater current per stack.

While FinFET structures must modulate the number of fins in a discrete way, MBCFET™ provides greater design flexibility by controlling the nanosheet width. In addition, MBCFET™’s compatibility with FinFET processes means the two can share the same manufacturing technology and equipment, which accelerates process development and production ramp-up.

Samsung recently taped out the 3GAE test vehicle design and will focus on improving its performance and power efficiency going forward.

For more information, please refer to the Newsroom links for GAA infographic and video clip.

The launching of a new SAFE TM -Cloud program

As part of its ongoing efforts to support and enhance customers’ entire design workflow, Samsung Electronics launched the Samsung Advanced Foundry Ecosystem Cloud (SAFE™-Cloud) program. It will provide customers with a more flexible design environment through collaboration with major public cloud service providers, such as Amazon Web Services (AWS) and Microsoft Azure, as well as leading Electronic Design Automation (EDA) companies, including Cadence and Synopsys.

To date, most foundry customers have built and managed design infrastructure on their own servers. The SAFE™-Cloud program reduces this burden and supports easier, faster and more efficient design efforts by providing an excellent turnkey design environment with extensive process information (PDK, design methodologies), EDA tools, design assets (IP, library) and design services.

Customers can be assured of as much server and storage space as they need, as well as a safe environment optimized for chip design, due to Samsung Electronics’ verification of SAFE™-Cloud’s security, applicability and expandability.

Utilizing the SAFE™-Cloud platform, Samsung was able to accelerate the development of its 7nm and 5nm cell libraries in collaboration with Synopsys. In addition, Samsung, Gaonchips – a fabless design company in Korea – and Cadence have successfully completed design verification based on the platform.

“Making up-front investments in high-performance computing (HPC) servers and systems can be a challenge for a company like us,” said Kyu Dong Jung, CEO of Gaonchips. “SAFETM-Cloud offers us a very flexible design environment without requiring investment in additional infrastructure, as well as reduced design TAT. I expect this program to provide more tangible business and technical benefits to us and the entire fabless industry.”

Process technology roadmap and advanced packaging updates

Samsung’s roadmap includes four FinFET-based processes from 7nm down to 4nm that leverage extreme ultraviolet (EUV) technology as well as 3nm GAA, or MBCFET™.

In the second half of this year, Samsung is scheduled to start the mass production of 6nm process devices and complete the development of 4nm process.

The product design of Samsung’s 5nm FinFET process, which was developed in April, is expected to be completed in the second half of this year and go under mass production in the first half of 2020.

Extensions of the company’s FD-SOI (FDS) process and eMRAM together with an expanded set of state-of-the-art package solutions were also unveiled at this year’s Foundry Forum. Development of the successor to the 28FDS process, 18FDS, and eMRAM with 1Gb capacity will be finished this year.

# # #

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)6196-66-3300
Email: ujeong.j@samsung.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

H2SITE Secures EIC Accelerator Funding to Deploy a Flagship 1 TPD Ammonia Cracker Using Membrane Reactor Technology at a Port in North-West Europe3.7.2025 09:40:00 EEST | Press release

H2SITE has been awarded the EIC (European Innovation Council) Accelerator program for a project aimed at deploying a first-of-its-kind ammonia cracking unit capable of producing 1 ton of high-purity hydrogen per day. The system is based on H2SITE’s proprietary palladium-based membrane reactor technology, which enables the simultaneous catalytic decomposition of ammonia and selective hydrogen separation within a single unit. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250702142283/en/ Ammonia Cracker using Membrane Reactor Technology This breakthrough technology offers several compelling advantages over conventional ammonia cracking processes: Lowest Levelized Cost of Hydrogen (LCOH) from ammonia due to high efficiency and integrated operation Reduced energy consumption, operating at significantly lower temperatures (400–450 °C) than traditional cracking methods (typically 600–800 °C) High-purity hydrogen output, compliant

ISDA and Ant International Lead New Industry Report on Use of Tokenised Bank Liabilities for FX Settlement and Cross-Border Payments Under Project Guardian3.7.2025 09:00:00 EEST | Press release

The International Swaps and Derivatives Association (ISDA) and Ant International led the Project Guardian FX industry group to develop a new report for implementing tokenised bank liabilities and shared ledger in cross-border payments and foreign exchange (FX) settlement. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250702791535/en/ Report on Use of Tokenised Bank Liabilities for Transaction Banking by ISDA and Ant International, under the Monetary Authority of Singapore's (MAS) Project Guardian The joint report is produced under the Monetary Authority of Singapore's (MAS) Project Guardian, a global collaboration between policymakers and key industry players to enhance liquidity and efficiency of financial markets through asset tokenisation. ISDA and Ant International are members of the industry group and lead the FX workstream to develop FX data specifications, risk management frameworks and FX documentation. Other contri

Curve Pay and Thales Join Forces to Securely Transform Digital Wallets on iPhone3.7.2025 09:00:00 EEST | Press release

Curve, the ultimate digital wallet, today announced deepening its collaboration with Thales, the global leader in advanced technologies, delivering secure modern payment solutions for financial institutions. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250702696837/en/ Thales D1 Platform to power CURVE PAY (Photo: Thales) This partnership comes on the back of Curve launching Curve Pay on iOS, marking a watershed moment in mobile payments. This partnership is a significant step to reshaping everyday spending, allowing Curve customers to benefit from NFC payment directly in the Curve App for contactless payments in store for all end-users on iOS and Android. Curve Pay is underpinned by Thales’ D1 platform on iOS and Android in Europe which allows customers to digitize a payment card through a mobile wallet. The cloud-based D1 platform operates in real time, enabling seamless integration with existing systems to deliver secur

Medimaps Group Launches In Europe TBS Osteo Next-Generation Software For Advanced Bone Microarchitecture Assessment3.7.2025 09:00:00 EEST | Press release

Medimaps Group S.A., a global leader in AI-driven bone microarchitecture imaging solutions, announces the European launch of its MDR-cleared next-generation TBS Osteo Advanced software. Following the product launch in the United States last month, this next milestone reflects the company's commitment to advancing osteoporosis detection and bone health management worldwide. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250702082335/en/ Medimaps' TBS Osteo next-generation software The TBS Osteo Advanced software delivers refined correction for soft tissue thickness anterior to the lumbar spine, ensuring inclusivity of TBS assessment across a wide range of body phenotypes. It also introduces new system management capabilities, allowing hospitals and healthcare networks to centrally manage the TBS software on their DXA systems fleet, and to standardize workflows across multiple locations. These improvements enhance operational

Year-old European startup Maisa named alongside Google and Amazon in elite list of leading AI agent vendors in top global US research reports by Gartner3.7.2025 02:01:00 EEST | Press release

Maisa, a rising star of enterprise AI, has been named by leading global research and advisory firm Gartner in its list of leading vendors for developing reliable AI agents. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250702640749/en/ Maisa founders David Villalón and Manuel Romero Inclusion in Gartner’s 2025 Hype Cycle for AI and Hype Cycle for the Future of Work marks the first time a Spanish startup has been mentioned in these influential reports. The company, which is barely a year old and made its first raise of $5m+ from leading US investors last year, now finds itself named alongside global giants Amazon Web Services, Google, Salesforce and LangChain. The Gartner Hype Cycle for AI Agents provides an overview of emerging technologies in AI, helping organizations navigate the evolving landscape of autonomous software agents. The Hype Cycle for the Future of Work provides CIOs with a crucial human-first lens on the tra

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye