Samsung Introduces Three New Logic Solutions to Power the Next Generation of Automobiles
30.11.2021 13:00:00 EET | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced three of its latest automotive chip solutions; the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems, and the ASIL-B certified S2VPS01 power management IC (PMIC) for the Auto V series.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211130005513/en/
Exynos Auto T5123, a 3GPP Release 15 telematics control unit for 5G connectivity solution for automobiles, Exynos Auto V7, a powerful processor for IVI systems in mid to high-end vehicles and S2VPS01, power management IC with ASIL-B certification for the Exynos Auto V series (Graphic: Business Wire)
“Smarter and more connected automotive technologies for enriched in-vehicle experiences including entertainment, safety and comfort are becoming critical features on the road,” said Jaehong Park, Executive Vice President of System LSI Custom SOC Business at Samsung Electronics. “With an advanced 5G modem, an AI-enhanced multi-core processor, and a market-proven PMIC solution, Samsung is transfusing its expertise in mobile solutions into its automotive lineup and is positioned to expand its presence within the field.”
Exynos Auto T5123: The Industry’s First 5G Connectivity Solution for Automobiles
The Exynos Auto T5123 is a 3GPP Release 15 telematics control unit specifically designed to bring fast and seamless 5G connectivity in both standalone (SA) and non-standalone (NSA) mode to the next generation of connected cars. It delivers essential information to the vehicle in real-time via high-speed download of up to 5.1 gigabits per second (Gbps) and allows passengers to enjoy a host of new services such as high-definition content streaming and video calls on the go.
To efficiently process large amounts of data transmitted and received through the 5G modem, the Exynos Auto T5123 supports a high speed PCIe (PCI Express) interface and a low-power high-performance LPDDR4x mobile DRAM. In addition, the unit comes with two Cortex-A55 CPU cores and a built-in Global Navigation Satellite System (GNSS) to minimize the use of external ICs and help reduce product development time. The T5123 meets stringent requirements for automotive components and is Automotive Electronics Council-Q100 (AEC-Q100) qualified.
The Exynos Auto T5123 is currently in mass production and is delivering 5G-based vehicle communication capabilities for the first time in the industry.
Exynos Auto V7: A Powerful Processor for IVI Systems in Mid to High-end Vehicles
The Exynos Auto V7 is the newest addition to Samsung’s automotive-brand processor lineup and is designed for in-vehicle infotainment systems. For powerful processing performance, the V7 integrates eight 1.5-gigahertz (GHz) Arm Cortex-A76 CPU cores and 11 Arm Mali G76 GPU cores. The GPU comes in two separate groups, with three cores in the ‘small’ domain for cluster display and AR-HUD, and eight in the ‘big’ domain for central information display (CID) and others. Such physical separation allows the GPU to support multiple systems simultaneously and brings safer operation as it keeps one domain from interfering with another. In addition to its powerful CPU and GPU, the V7 is equipped with an NPU for convenient services such as virtual assistance that can process visual and audio data for face, speech or gesture recognition features.
For a safer and more enjoyable driving experience, the Exynos Auto V7 supports up to four displays and 12 camera inputs that provide information to assist drivers and passengers. The V7’s imaging system provides bad pixel correction, dynamic range compression and geometric distortion correction to provide noiseless and distortion-free images for features like surround view and parking assistance. For immersive in-car entertainment, the chip comes with three HiFi 4 audio processors that deliver excellent audio quality for songs, movies and even games on the go. To run all these features as smoothly as possible, the V7 has up to 32 gigabytes (GB) of LPDDR4x memory capacity that offers high bandwidth of up to 68.3 gigabytes per second (GB/s).
The Exynos Auto V7 also offers strong data protection through an isolated security processor for crypto operation and provides a hardware key using a one-time programmable (OTP) or physical unclonable function (PUF). Furthermore, for critical functional safety, the Exynos Auto V7 complies with ASIL-B requirements of safety support for a digital cluster and an embedded safety island that detect and manage faults to maintain a safe state with a fault management unit (FMU).
The Exynos Auto V7 is currently in mass production and is being used in Volkswagen’s latest In-Car Application-Server (ICAS) 3.1, developed by LG Electronics’ VS (Vehicle component Solutions) division, to power their next-generation in-vehicle infotainment system.
S2VPS01 – An ASIL-B Certified Power Management IC for the Exynos Auto V Series
The S2VPS01 is a PMIC specifically designed and developed for the Exynos Auto V9 and V7. It is Samsung’s first automotive solution produced under the ISO 26262 functional safety process certification that was acquired in 2019, and it also achieved an ASIL-B certification in 2021.
An Automotive Safety Integrity Level (ASIL), specified under ISO 26262, ranges from A to D, with D being the highest level. The Level is assigned by analyzing and assessing the severity, exposure and controllability of vehicle operations in a number of environments. To ensure the safety of vehicle systems, ASIL-B compliance is becoming a key requirement for automotive OEMs and their Tier 1 suppliers when selecting partners and solutions.
The S2VPS01 regulates and rectifies the flow of electrical power, allowing reliable and robust in-vehicle infotainment system performance. It is comprised of highly efficient triple/dual-phase buck converters, and integrates a low-dropout regulator (LDO) and real-time clock (RTC) within the package. For protection from harsh thermal and electrical conditions, the power IC comes with various protection functions including over voltage protection (OVP), under voltage protection (UVP), short circuit protection (SCP), over current protection (OCP), thermal shut down (TSD), clock monitoring, and output stuck checks.
For more information about Samsung’s Exynos products, please visit http://www.samsung.com/exynos.
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211130005513/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 02:00:00 EEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 02:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stacking 332 layers and improving lateral density
Bending Spoons S.p.A. announces closing of initial public offering2.7.2026 21:35:00 EEST | Press release
Bending Spoons S.p.A. (“Bending Spoons”), a leading technology company, today announces the closing of its initial public offering of an aggregate of 57,971,015 of its ordinary shares, at an initial public offering price of $29.00 per share. The offering consisted of 34,398,640 shares sold by Bending Spoons and 23,572,375 shares sold by certain selling shareholders (the “Selling Shareholders”). The gross proceeds from the offering to Bending Spoons, before deducting underwriting discounts and commissions and other offering expenses, was approximately $953,917,285.50. Bending Spoons did not receive any proceeds from the sale of shares by the Selling Shareholders. Bending Spoons’ ordinary shares began trading on the Nasdaq Global Select Market on July 1, 2026 under the ticker symbol “BSP”. Goldman Sachs International, J.P. Morgan, and Allen & Company LLC are acting as joint lead book-running managers for the offering. Wells Fargo Securities, BofA Securities, Jefferies, Evercore ISI, BNP
Strategic Partnership Between Record Asset Management and Admicasa2.7.2026 20:00:00 EEST | Press release
RAM Swiss Holding AG is a subsidiary of LSE-listed Record Financial Group (Record) and part of the Record Asset Management (RAM) group of companies. The partnership is a milestone in the growth of Admicasa and marks an important step in the continued expansion of Record’s private markets platform. Subject to regulatory approval, the agreement, signed on 1st July 2026, provides RAM Swiss Holding AG with a 50% participation in the Admicasa Fondsleitung AG, part of Admicasa, and establishes a long-term partnership to develop investment opportunities in the Swiss and Global real estate market with a plan to expand into other asset classes in the medium term. RAM is the European asset management arm of Record, the LSE-listed specialist investment group managing USD 115 billion of assets on behalf of institutional clients worldwide. Record's client base comprises pension funds, foundations, sovereign institutions and other asset managers, with whom it has built long-standing relationships th
IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange2.7.2026 17:47:00 EEST | Press release
IQM Quantum Computers (Nasdaq: IQMX) (“IQM”, “IQM Quantum Computers” or the “Company”), a global leader in full-stack superconducting quantum computers, today became a publicly traded company following the completion of its business combination with Real Asset Acquisition Corp. (“RAAQ”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702960460/en/ IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange The company’s American Depositary Shares begin trading today on the Nasdaq Global Select Market under the ticker symbol “IQMX”. The listing marks a major milestone for IQM establishing the company as the first European quantum computing company listed on a major U.S. stock exchange. Due to the proceeds of the transaction, IQM maintains a strong pro forma cash position of EUR 337 million. IQM enters the public markets with strong commercial momentum and a rapidly expanding globa
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom