Business Wire

Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions

9.6.2021 11:00:00 EEST | Business Wire | Press release

Share

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduces its newest radio frequency (RF) technology based on 8-nanometer (nm) process.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210609005359/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

[Infographic] 8nm RF Technology (Graphic: Business Wire)

This cutting-edge foundry technology is expected to provide a ‘one chip solution,’ specifically for 5G communications with support for multi-channel and multi-antenna chip designs. Samsung’s 8nm RF platform extension is expected to expand the company’s leadership in the 5G semiconductor market from sub-6GHz to mmWave applications.

Samsung’s 8nm RF process technology is the latest addition to an already broad portfolio of RF-related solutions, including 28nm- and 14nm-based RF. The company has established its RF market leadership through the shipping of more than 500 million mobile RF chips for premium smartphones since 2017.

“Through excellence in innovation and process manufacturing, we’ve reinforced our next-generation wireless communication offerings,” said Hyung Jin Lee, Master of Foundry Technology Development Team at Samsung Electronics. “As 5G mmWave expands, Samsung’s 8nm RF will be a great solution for customers looking for long battery life and excellent signal quality on compact mobile devices.”

Samsung’s New RFeFET™ Architecture

With continued scaling to advanced nodes, digital circuits have improved significantly in performance, power consumption, and area (PPA), whereas the analog/RF blocks haven’t enjoyed such an improvement due to degenerative parasitics such as increased resistance from narrow line width. As a result, most communications chips tend to see degraded RF characteristics such as deteriorated amplification performance of reception frequency and increased power consumption.

To overcome the analog/RF scaling challenges, Samsung has developed a unique architecture exclusive to 8nm RF named RFextremeFET (RFeFET™) that can significantly improve RF characteristics while using less power. In comparison to 14nm RF, Samsung’s RFeFET™ supplements the digital PPA scaling and restores the analog/RF scaling at the same time, thereby enabling high-performance 5G platforms.

Samsung’s process optimization maximizes channel mobility while minimizing parasitics. As the performance of RFeFET™ is greatly improved, the total number of transistors of RF chips and the area of analog/RF blocks can be reduced.

Compared to 14nm RF, Samsung’s 8nm RF process technology provides up to a 35-percent increase in power efficiency with a 35-percent decrease in the RF chip area as a result of the RFeFET™ architectural innovation.

# # #

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

SES Delivers Solid 9 Months & Q3 2026 Results and Reiterates Full-Year Outlook5.11.2026 11:22:00 EET | Press release

SES S.A. announces financial results for the nine and three months ended September 30, 2026. YTD 2026 Performance (€ million) YTD 2026 as reported (1) YTD 2025 as reported (1)(5) ∆ At constant FX (2) YTD 2025 like-for-like(3) ∆ At constant FX (2) Average €/$ FX rate 1.16 1.11 1.11 Revenue 2,472 1,743 +45.5% 2,628 -2.0% Adjusted EBITDA (4) 1,138 838 +40.0% 1,170 +1.4% 1) ‘Reported basis’ with Intelsat fully consolidated from July 17, 2025 2) ‘At constant FX’ refers to comparative figures restated at the current period FX rates to neutralize currency variations 3) ‘Like-for-like basis’ is as if Intelsat was fully consolidated from January 1, 2024 4) Excluding operating expenses/income recognized in relation to U.S. C-band repurposing, other income non-recurring, fair value movement on contingent value rights and other significant special items (disclosed separately) 5) 2025 has been restated to reflect Purchase Price Allocation (PPA) adjustments recorded in connection with the acquisitio

I’m green™ bio-based Polyethylene, Produced From Sugarcane-Derived Renewable Feedstock, Incorporated Into Mondi’s Flexible Pouch5.11.2026 11:17:00 EET | Press release

At Interpack 2026, I’m green™ bio-based and Mondi presented a forward-thinking approach to flexible packaging, combining renewable material innovation with process simplicity to reduce environmental impact without compromising functionality. Renewable materials meet flexible packaging At the heart of the solution is Mondi’s re/cycle StripPouch, made with at least 98% I’m green™ bio-based polyethylene derived from renewable sugarcane, offering an alternative to conventional fossil-based materials. By integrating I’m green™ bio-based polyethylene into the design, the collaboration demonstrates the potential to expand the use of bio-based materials in high-performance applications such as food, home and personal care packaging. The pouch also incorporates laser-marking technology during the converting process, eliminating the need for inks and additional processing steps. This not only simplifies the packaging design but also contributes to faster artwork changes, greater personalisation

Diplomacy, Business, Innovation : SIAL Paris 2026 at the Heart of Global Food Challenges5.11.2026 11:00:00 EET | Press release

305,000 professionals, 8,000 exhibitors and 192 countries and regions represented: SIAL Paris reaffirms its role as a global platform for influence, business and food innovation. Held under the High Patronage of the President of the French Republic, SIAL Paris closed its doors on October 21 after five days that made Paris the centre of gravity for the global food industry. A meeting of G7 Agriculture Ministers, India as Country of Honour and food sovereignty were among the defining highlights of this edition. SIAL Paris, where nations come together Against a backdrop of geopolitical tensions and shifting international trade dynamics, SIAL Paris reinforced its role as a platform for international dialogue. On October 19, a high-level meeting dedicated to food security and sovereignty brought together Agriculture Ministers and G7 representatives, alongside European Commissioner Christophe Hansen. More than 100 diplomatic and international delegations attended the event. This internationa

Festo, Softcat, ANS Group and SCC Demonstrate the Business Impact of AI-Powered Observability5.11.2026 10:00:00 EET | Press release

LogicMonitor®, the AI-first platform for Autonomous IT, announced the 2026 Elevate Award winners today at its Elevate Community Conference in London. The annual awards recognize LogicMonitor customers and partners that are achieving measurable business and operational outcomes through AI-powered observability. From consolidating 90% of monitoring tools and reducing alert noise by 85% to cutting observability case volumes by 45%, this year's EMEA winners demonstrate how organizations are simplifying complex IT environments, improving resilience and putting AI-powered operations into practice. “This year's EMEA Elevate Award winners are proving that the path to Autonomous IT starts with real, measurable improvements in how organizations operate,” said John Grosshans, President of Field Operations, LogicMonitor. “They're reducing complexity, giving teams time back and using AI to make better decisions and take more effective action. We're proud to recognize their achievements and the impa

New AGCO Power CORE Engines to Power Two New Tractors at EIMA 20265.11.2026 08:00:00 EET | Press release

At EIMA International in Bologna, Italy, on November 10–14, 2026, visitors will be able to see how the AGCO Power CORE75 engine platform supports the different requirements of the Massey Ferguson new model MF 7S MARK 2 range and Valtra’s new sixth-generation Valtra T Series. A CORE75 engine will also be on display at the Valtra stand. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261104588496/en/ Massey Ferguson 7S MARK 2 The CORE engine family represents AGCO Power’s investment in a completely new engine platform at a time when few manufacturers are making comparable commitments to off-highway combustion engine development. The CORE engine family is designed to meet different power requirements, emissions regulations and machine integration needs. Its design combines fuel efficiency, strong low-speed torque and responsive performance for applications that demand dependable power over long working days. The family includes

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye