Sharp at CES 2020: Realizing an 8K+5G Ecosystem
6.1.2020 02:03:00 EET | Business Wire | Press release
Sharp Corporation (TOKYO:6753) is set to return to CES 2020 with an exhibit showcasing the latest installments in its evolving ecosystem of products and services that leverage the benefits of Ultra-HD 8K video and advanced 5G wireless technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20200105005022/en/
(Graphic: Business Wire)
Sharp’s 8K+5G Ecosystem comprises end-to-end solutions for the recording, editing, storage, and delivery of 8K content, with potential benefits extending far beyond entertainment and broadcasting to such diverse fields as industry, security, health, education, automotive, smart offices, and smart homes. One much-anticipated addition to a constantly expanding portfolio of 8K products and services is the new dynabook 8K video editing PC system, which with its 15.6-inch screen will provide a compact, convenient, prosumer-ready platform for the viewing and processing of 8K materials.
Meanwhile, striking examples of Sharp’s 8K+5G Ecosystem on display at CES 2020 will include a drone-mounted system developed in conjunction with various external stakeholders for the real-time capture and transmission of 8K footage for purposes including racehorse training and infrastructure surveys. It’s one of various cross-disciplinary collaborations currently undergoing trials in order to bring the practical benefits of 8K and 5G directly to businesses and consumers.
“Collaborations are a pillar of our efforts to leverage the benefits of 8K+5G,” says Bob Ishida, Executive Vice President and Head of ICT Group. “We are conducting trials with a range of external partners, all with the aim of realizing a comprehensive 8K+5G ecosystem as soon as possible. And as our CES 2020 exhibit will show, we firmly believe that, in conjunction with the introduction of 5G, our 8K technology can make a major contribution to the society of the future.”
Learn more about Sharp at CES 2020: https://global.sharp/brand/globalevents/ces2020/
About Sharp
Sharp Corporation is a worldwide developer of innovative products and core technologies that play a key role in shaping the future of electronics. Sharp sets its business vision as “Changing the World with 8K+5G and AIoT.” 8K technology creates images that reveal a world beyond our everyday reality and gives birth to thrilling new discoveries. AIoT connects people and society through artificial intelligence and IoT technology. Being the origin of countless innovations, through these ideas, Sharp will continue to revolutionize the world. Sharp Corporation employs 52,640 people around the world (as of September 30, 2019) and recorded consolidated annual sales of 2.4 trillion yen for the fiscal year ended March 31, 2019.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20200105005022/en/
Contact information
Sharp Corporation
PR/Branding Team
pr-brand@sharp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom