Shin-Etsu Chemical Develops New Thermal Interface Silicone Rubber Sheet Series for Applications in Components of Electric Vehicles as the Technology for High Voltage Devices Advances
13.4.2022 09:00:00 EEST | Business Wire | Press release
Shin-Etsu Chemical Co., Ltd., (Head Office: Tokyo, President: Yasuhiko Saitoh) has newly developed thermal interface silicone rubber sheet, the “TC-BGI Series,” for applications in components for electric vehicles as the technology for high voltage devices advances.
At present, demand for electric cars is growing, starting with electric vehicles (EV), and going forward, further widespread market growth is expected. The components used in electric cars are required to be smaller and lighter, and to increase energy density, high voltage is required for the system voltage.
In order to meet these requirements, Shin-Etsu Chemical has been going forward with the development of thermal interface silicone materials that can be used as heat dissipation measures for component parts of electric cars for which high voltage requirements are increasing.
This new product, the “TC-BGI Series,” is a high hardness thermal interface silicone rubber sheet that has the combined characteristics of high voltage endurance and thermal conductivity that are achieved by means of our company’s own technologies, and this new product comes in 2 thicknesses: 0.2mm and 0.3mm.
The main characteristics of this new product are as follows:
1. It realizes a voltage endurance assurance that is at the highest level in the industry. We can assure a voltage endurance of 3kV with the thickness of 0.2mm, and 5kV with the thickness of 0.3mm on the entire surface of a sheet. Furthermore, we are in the process of developing a product that will assure more than 4kV voltage endurance with a sheet of 0.2mm thickness on the entire sheet surface.
2. It has high thermal conductivity of 7W/m・K.
3. It possesses high hardness and at the same time high strength, and it is superior in workability compared to the pad-type.
4. Compared to the non-silicone-type, it is superior in long-term reliability.
In order to strengthen an automobile’s performance and reliability, heat dissipation material is essential, and various products and technologies for achieving heat dissipation are being developed.
Shin-Etsu Chemical has a very wide line-up of various types of silicone thermal interface materials. In addition to silicone rubber sheets, we offer pads, greases (oil compounds), gap fillers, liquid rubbers (adhesives and potting material). Our wide variety of silicone thermal interface materials can meet the demand for various heat dissipation measures.
Along with the development of these new products, Shin-Etsu Chemical is moving forward in meeting our customers’ various requests regarding such areas as technical support with thermal analysis technologies, and we are manufacturing and processing at International Standard for Automotive Quality Management Systems (IATF16949:2016)-approved plants.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220412006182/en/
Contact information
For inquiries about this matter, please contact:
Shin-Etsu Chemical Co., Ltd.
Public Relations Dept.
Tetsuya Koishikawa
Tel: 03-6812-2340, or from outside Japan: 81-3-6812-2340
Fax: 03-6812-2341, or from outside Japan: 81-3-6812-2341
E-mail: sec-pr@shinetsu.jp
https://www.shinetsu.co.jp/en/
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 14:00:00 EET | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p
HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 13:00:00 EET | Press release
HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP) Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 Constraints Not Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. C
Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 10:15:00 EET | Press release
Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char
DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 09:18:00 EET | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers compared to currently available technologies. This in turn is boosting expectations
EdgeConneX Looks to Enter Swedish Market as Part of European Data Center Expansion Strategy27.2.2026 09:05:00 EET | Press release
EdgeConneX®, an EQT portfolio company with an extensive Pan-European data center footprint, looks to expand its presence with a new site located in Skellefteå, Sweden. The data center site will be acquired from Lyten, a global company that specializes in lithium-sulfur batteries and energy storage. The site would support EdgeConneX broader strategy to expand digital infrastructure capacity across the Nordics. Subject to the completion of applicable administrative and regulatory processes, EdgeConneX will look to develop a data center campus with potential capacity of up to one gigawatt in support of future AI and cloud computing workloads. Upon completion, the data center campus would be one of the largest facilities in Europe that would be primarily powered by renewable energy. “Sweden represents an attractive long‑term market for digital infrastructure investment. The country’s access to renewable energy, stable power grid, technical workforce and strong sustainability framework alig
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom