Shin-Etsu Chemical Develops New Thermal Interface Silicone Rubber Sheet Series for Applications in Components of Electric Vehicles as the Technology for High Voltage Devices Advances
13.4.2022 09:00:00 EEST | Business Wire | Press release
Shin-Etsu Chemical Co., Ltd., (Head Office: Tokyo, President: Yasuhiko Saitoh) has newly developed thermal interface silicone rubber sheet, the “TC-BGI Series,” for applications in components for electric vehicles as the technology for high voltage devices advances.
At present, demand for electric cars is growing, starting with electric vehicles (EV), and going forward, further widespread market growth is expected. The components used in electric cars are required to be smaller and lighter, and to increase energy density, high voltage is required for the system voltage.
In order to meet these requirements, Shin-Etsu Chemical has been going forward with the development of thermal interface silicone materials that can be used as heat dissipation measures for component parts of electric cars for which high voltage requirements are increasing.
This new product, the “TC-BGI Series,” is a high hardness thermal interface silicone rubber sheet that has the combined characteristics of high voltage endurance and thermal conductivity that are achieved by means of our company’s own technologies, and this new product comes in 2 thicknesses: 0.2mm and 0.3mm.
The main characteristics of this new product are as follows:
1. It realizes a voltage endurance assurance that is at the highest level in the industry. We can assure a voltage endurance of 3kV with the thickness of 0.2mm, and 5kV with the thickness of 0.3mm on the entire surface of a sheet. Furthermore, we are in the process of developing a product that will assure more than 4kV voltage endurance with a sheet of 0.2mm thickness on the entire sheet surface.
2. It has high thermal conductivity of 7W/m・K.
3. It possesses high hardness and at the same time high strength, and it is superior in workability compared to the pad-type.
4. Compared to the non-silicone-type, it is superior in long-term reliability.
In order to strengthen an automobile’s performance and reliability, heat dissipation material is essential, and various products and technologies for achieving heat dissipation are being developed.
Shin-Etsu Chemical has a very wide line-up of various types of silicone thermal interface materials. In addition to silicone rubber sheets, we offer pads, greases (oil compounds), gap fillers, liquid rubbers (adhesives and potting material). Our wide variety of silicone thermal interface materials can meet the demand for various heat dissipation measures.
Along with the development of these new products, Shin-Etsu Chemical is moving forward in meeting our customers’ various requests regarding such areas as technical support with thermal analysis technologies, and we are manufacturing and processing at International Standard for Automotive Quality Management Systems (IATF16949:2016)-approved plants.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220412006182/en/
Contact information
For inquiries about this matter, please contact:
Shin-Etsu Chemical Co., Ltd.
Public Relations Dept.
Tetsuya Koishikawa
Tel: 03-6812-2340, or from outside Japan: 81-3-6812-2340
Fax: 03-6812-2341, or from outside Japan: 81-3-6812-2341
E-mail: sec-pr@shinetsu.jp
https://www.shinetsu.co.jp/en/
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Xsolla President Chris Hewish Debuts “Durable Advantage” at Gamescom 202626.8.2026 10:00:00 EEST | Press release
Xsolla, a leading global commerce company, today announced Durable Advantage: Five Pillars of the Modern Game Business, a new book authored by Chris Hewish, President of Xsolla, launching at Gamescom 2026 in Cologne. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260826628682/en/ Graphic: Xsolla Xsolla's integrated strategy brings together global payments, direct-to-consumer commerce, backend infrastructure, and AI-powered development tools into a unified operating model designed to help studios launch, operate, and scale more efficiently. Rather than relying on disconnected commerce, engagement, and backend systems, developers can activate new capabilities through a common platform foundation that reduces complexity, accelerates deployment, and creates a more durable foundation for long-term growth. The strategic framework behind this vision is outlined in Durable Advantage. "There are two kinds of game companies, renters a
David Hagan, Dean and Pegasus Professor at CREOL, The College of Optics and Photonics, Will Serve as Vice President of SPIE26.8.2026 06:00:00 EEST | Press release
David Hagan has been elected to serve as the 2027 Vice President of SPIE, the international society for optics and photonics. He will serve as President-Elect in 2028, and as the Society’s President in 2029. The SPIE Board of Directors is influential in the scientific community, establishing policy and strategy and conducting activities of interest to SPIE Members. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825934622/en/ Top row, from left to right: David Hagan, Jim McNally, Mark Clampin. Bottom row, from left to right: Marla Dowell, Jana Kainerstorfer, Katie Schwertz The 2026 SPIE President, Julie Bentley, professor of optics at the University of Rochester, made the new electees announcement at the Annual General Meeting of the Society on 25 August during SPIE Optics + Photonics. Terms begin on 1 January 2027. In addition to his work at CREOL (University of Florida, USA), Hagan has been an SPIE Fellow since 2017.His
FORTÉ Acquires Vega Global, APAC's Largest Systems Integrator, Expanding Global Reach26.8.2026 04:00:00 EEST | Press release
FORTÉ, the leader in communication and collaboration solutions designed for the modern workplace, today announced its acquisition of Vega Global, APAC’s largest systems integrator and a leading provider of workplace technology and audiovisual solutions serving corporate, education, government and other market segments. With this acquisition, FORTÉ adds to its international presence, including established office locations in Hong Kong, Mainland China, India, Japan, Taiwan, Thailand, Singapore, Korea, Vietnam, Australia, Philippines, Malaysia, Macau, New Zealand, Indonesia, and United Arab Emirates. With its headquarters in Minneapolis, Minn., FORTÉ also has operations in the U.S., Ireland, Germany, Sweden, the United Kingdom, and Mexico. “Multinational organizations need strategic partners who can deliver consistent communication and collaboration experiences wherever their people work and do business,” said Jeff Stoebner, Chairman and CEO of FORTÉ. “With Vega Global now part of FORTÉ,
Access Advance Launches Exploration Phase for an AV1/AV2 Device and Software Patent Pool, Invites Participation of Potential Licensors26.8.2026 03:00:00 EEST | Press release
Access Advance LLC announced today that in conjunction with the recent release of the AV2 video codec specification, it has launched the exploratory phase for a new patent pool covering devices and software implementing the AV2 video codec, as well as its predecessor AV1. During this exploratory phase, Access Advance will engage with market participants to seek their input, including holding pool formation discussions with potential licensors to gather their feedback on the scope, structure, and terms of a prospective program. All patent owners with a good-faith belief that they own or control AV1 and/or AV2 essential patents are invited to participate in the pool formation discussions. AV1 adoption is being driven largely by members of the Alliance for Open Media (“AOM”). AOM members such as Google, Meta, and Netflix increasingly utilize AV1 to deliver video, and adoption now spans smart TVs, streaming media players, mobile devices, web browsers, and chipsets. AV2, AOM’s successor to
Lattice to Showcase Industrial FPGA Innovations at FPGAWorld Conference 202625.8.2026 23:00:00 EEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming FPGAWorld Conference 2026, taking place on Sept. 8, 2026, in Stockholm, Sweden. As part of the event, Lattice will deliver technical presentations and host a demo showcase focused on how its low power FPGA solutions are advancing Industrial IoT and sensor bridging applications. Who: Lattice Semiconductor What / When (GMT+2): Tuesday, Sept. 8, 2026 Lattice Demo Showcase Presentations (Track: 12:20 – 13:35, Room Brave 05) “Solving Your Power Puzzle: Lattice FPGAs’ Path to Uncompromised Low Power” “Practical Security Fundamentals for FPGA Engineers” Where: AFRY, Frösundaleden 2A, 169 70 Solna, Sweden The FPGAWorld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational and industrial cases,
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom