Shin-Etsu Chemical Develops New Thermal Interface Silicone Rubber Sheet Series for Applications in Components of Electric Vehicles as the Technology for High Voltage Devices Advances
13.4.2022 09:00:00 EEST | Business Wire | Press release
Shin-Etsu Chemical Co., Ltd., (Head Office: Tokyo, President: Yasuhiko Saitoh) has newly developed thermal interface silicone rubber sheet, the “TC-BGI Series,” for applications in components for electric vehicles as the technology for high voltage devices advances.
At present, demand for electric cars is growing, starting with electric vehicles (EV), and going forward, further widespread market growth is expected. The components used in electric cars are required to be smaller and lighter, and to increase energy density, high voltage is required for the system voltage.
In order to meet these requirements, Shin-Etsu Chemical has been going forward with the development of thermal interface silicone materials that can be used as heat dissipation measures for component parts of electric cars for which high voltage requirements are increasing.
This new product, the “TC-BGI Series,” is a high hardness thermal interface silicone rubber sheet that has the combined characteristics of high voltage endurance and thermal conductivity that are achieved by means of our company’s own technologies, and this new product comes in 2 thicknesses: 0.2mm and 0.3mm.
The main characteristics of this new product are as follows:
1. It realizes a voltage endurance assurance that is at the highest level in the industry. We can assure a voltage endurance of 3kV with the thickness of 0.2mm, and 5kV with the thickness of 0.3mm on the entire surface of a sheet. Furthermore, we are in the process of developing a product that will assure more than 4kV voltage endurance with a sheet of 0.2mm thickness on the entire sheet surface.
2. It has high thermal conductivity of 7W/m・K.
3. It possesses high hardness and at the same time high strength, and it is superior in workability compared to the pad-type.
4. Compared to the non-silicone-type, it is superior in long-term reliability.
In order to strengthen an automobile’s performance and reliability, heat dissipation material is essential, and various products and technologies for achieving heat dissipation are being developed.
Shin-Etsu Chemical has a very wide line-up of various types of silicone thermal interface materials. In addition to silicone rubber sheets, we offer pads, greases (oil compounds), gap fillers, liquid rubbers (adhesives and potting material). Our wide variety of silicone thermal interface materials can meet the demand for various heat dissipation measures.
Along with the development of these new products, Shin-Etsu Chemical is moving forward in meeting our customers’ various requests regarding such areas as technical support with thermal analysis technologies, and we are manufacturing and processing at International Standard for Automotive Quality Management Systems (IATF16949:2016)-approved plants.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220412006182/en/
Contact information
For inquiries about this matter, please contact:
Shin-Etsu Chemical Co., Ltd.
Public Relations Dept.
Tetsuya Koishikawa
Tel: 03-6812-2340, or from outside Japan: 81-3-6812-2340
Fax: 03-6812-2341, or from outside Japan: 81-3-6812-2341
E-mail: sec-pr@shinetsu.jp
https://www.shinetsu.co.jp/en/
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IFF to Webcast Fireside Chat at Barclays Global Consumer Conference on Sept. 1018.8.2026 23:15:00 EEST | Press release
IFF (NYSE: IFF) today announced that Chief Executive Officer Erik Fyrwald will participate in a fireside chat at the Barclays Global Consumer Conference on Thursday, Sept. 10, 2026 at 945 a.m. ET. Investors may access the live webcast on the Company's website at ir.iff.com. For those unable to listen to the live webcast, a recorded version will be made available for replay. Welcome to IFF At IFF (NYSE: IFF), we make joy through science, creativity and heart. As the global leader in flavors, fragrances, and health and biosciences, we deliver groundbreaking, sustainable innovations that elevate everyday products—advancing wellness, delighting the senses and enhancing the human experience.Learn more at iff.com, LinkedIn, Instagram and Facebook. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818490253/en/
Lehman Brothers Treasury Announces the Successful Sale of its Remaining Intercompany Claim against Lehman Brothers Holdings Inc.18.8.2026 22:15:00 EEST | Press release
In connection with its previously announced final wind-down, Lehman Brothers Treasury Co. B.V. in liquidation (“LBT”), through its U.S. counsel Herbert Smith Freehills Kramer (US) LLP, announced that its placement agent, Seaport Loan Products LLC, successfully closed the sale of LBT’s remaining $19.6 billion Class 4A intercompany claim against Lehman Brothers Holdings Inc. The net proceeds of the sale, together with certain available cash (but after deducting various sale-related and other administrative costs and expenses), will be used to fund a final distribution to the holders of LBT’s existing notes, after which such existing notes will be canceled and LBT shall be fully wound down. As a result, LBT will cease to exist. LBT expects the final distribution to occur in the course of October 2026 and the wind down to have been completed before the end of 2026. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818004215/en/
GenBio AI Builds First World Model of the Human Cell18.8.2026 16:00:00 EEST | Press release
GenBio AI ('GenBio') is an AI for Science company co-founded by Nobel Laureate David Baker, leading AI scientist Eric Xing, and other prominent life science and artificial intelligence researchers from Stanford, Carnegie Mellon University, Mohamed Bin Zayed University of Artificial Intelligence, Harvard, Weizmann Institute, and other research institutions. Today, the company introduced AIDO Cell, its virtual cell world model — the first system capable of simulating a human cell, both in its natural state and in response to drugs and other interventions, across its full biological hierarchy, from DNA and RNA through protein to the whole-cell level. A Key First in Biological and Medical Sciences: Full-hierarchy virtual cell simulation has been widely identified as a key milestone in computational biology. Compared to the previous efforts by various research labs, AIDO Cell is the first to integrate the entire molecular-to-cellular spectrum into one continuous simulation. Using the system
Xsolla Partner Network Expands Verified Creator Partnerships and Unifies Campaign Management Ahead of gamescom 202618.8.2026 16:00:00 EEST | Press release
Xsolla, a global video game commerce company, today announced an expansion of the Xsolla Partner Network ahead of gamescom 2026 in Cologne, giving game developers a simpler, more reliable way to grow their games through creators. The creator platform now lives within Xsolla Publisher Account, where developers already run their business, with verified creator onboarding and a redesigned and unified campaign workflow. Flat-fee campaigns, a new guaranteed payment option alongside revenue share, and data-driven creator recommendations are coming soon. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818140062/en/ Graphic: Xsolla Xsolla Partner Network gives developers one place to launch, manage, track, and report on creator campaigns while Xsolla handles payments, payouts, taxes, and compliance. Verified creators, less guesswork. Automated anti-fraud vetting and identity verification at payout means developers partner with rea
KOCCA to Showcase 13 Korean Game Companies at ‘Gamescom 2026’ with PC, Mobile, and VR Lineups18.8.2026 15:48:00 EEST | Press release
The Korea Creative Content Agency (KOCCA) announced that 13 Korean game companies will gather under one roof at Gamescom 2026, Europe’s largest game show, held in Cologne, Germany, from August 26 to 28 (B2B, 09:00~20:00). Located in Booth Hall 3.2 C-050g–D051g, the Korea Joint Pavilion offers visitors hands-on experiences with an expansive lineup of titles, ranging from PC and mobile games to VR-powered titles across diverse genres. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818271881/en/ KOCCA will bring 13 Korean game companies to Gamescom 2026 in Cologne, Germany (Image: KOCCA) The standout feature of this year’s joint pavilion is its overwhelming genre diversity. The lineup includes roguelike deckbuilders, visual novels, 2D shooters, rhythm action, and cooperative horror survival—catering to a broad spectrum of gamers—alongside immersive content that integrates AI and XR technology. Introducing the Participating T
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
