Business Wire

Strive Towards the Era of Metaverse: du UAE and Huawei Sign MoU on 5.5G Strategic Cooperation

2.3.2023 06:11:00 EET | Business Wire | Press release

Share

At Mobile World Congress (MWC) Barcelona 2023, du, from Emirates Integrated Telecommunications Company (EITC) and Huawei signed a Memorandum of Understanding (MoU) on 5.5G strategic cooperation, marking a new phase of their long-standing partnership.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230301005895/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

du UAE and Huawei signing MOU (Photo: Business Wire)

As one of the fastest-growing telecommunication operators in the UAE, du works closely with Huawei and has outstanding performance in 5G network experience and service development, capturing a large share of the Middle East market. Through this partnership, du and Huawei will strengthen cooperation in 5.5G innovation, including technological innovation, and E2E network evolution, to help du continuously enhance user experience and lead the UAE market in 5.5G development.

Saleem AlBlooshi, CTO of du UAE, Cao Ming, President of Huawei Wireless Network Product Line, CEO of Huawei UAE, Liu Jiawei, and other executives from both parties attended the signing ceremony.

According to the MoU, du and Huawei will collaborate on 5.5G in three aspects. For innovation, they will focus on key technologies, including ELAA-MM (Extremely Large Antenna Array Massive MIMO), Passive IoT, Virtual Large Carrier among others, and discuss E2E network evolution roadmap. In terms of application exploration, they will conduct research on new scenarios and identify potential applications based on local requirements, such as Metaverse, holographic meeting, XR. In ecosystem construction, they will work together with local and global industry partners to build a sound 5.5G ecosystem and promote multilateral business success.

Saleem AlBlooshi, CTO of du, said, “du is committed to working with industry leaders around the world to create new solutions that help us stay at the forefront of digital innovation. In line with the UAE's Metaverse strategy, our partnership with Huawei will enable du to achieve our goal of making 5.5G technology available for commercial use, and together we can create immersive XR experiences for users that are high-quality and reliable. Our goal is to create an ecosystem in which every aspect of life can benefit from the unique features that 5.5G technology has to offer, ranging from improved connectivity and faster speeds to full-scenario IoT and extensive coverage.”

Cao Ming, President of Huawei Wireless Network Product Line, said, "We're committed to provide innovative solutions based on user requirements. We will work with du on 5.5G innovation, explore and promote 5.5G technologies, and commercialize high-value use cases based on the local scenarios in UAE, to improve network experience and build a digital, intelligent world."

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Xu Jing, Huawei Technologies Co., Ltd, xujing70@huawei.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 16:15:00 EEST | Press release

Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challenge As investment in AI infrastructure accelerates, data center operators face growing pressure to deploy capacity faster than traditional utility infrastructure can support. At the

HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 15:30:00 EEST | Press release

HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logistics, one of the world’s most operationally demanding industries, HappyRobot is expanding across the supply chain as well as into insurance, energy and utilit

New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 15:30:00 EEST | Press release

Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth compared to the 8th-generation 3D flash memory and becomes the industry’s first QLC 3D flash memory technology to reach a 4.8 Gb/s 3 interface. Add

Thredd and Pliant Expand Partnership to Launch U.S. Commercial Credit Program, Accelerate Embedded Finance for Businesses4.8.2026 15:00:00 EEST | Press release

Thredd, the AI-first issuer processing platform, today announced the expansion of its partnership with Pliant, bringing the company’s commercial credit and embedded finance platform capabilities to the U.S. market for the first time. Pliant provides European businesses with physical and virtual credit cards that have built-in reconciliation, spend controls, and deep integrations into modern finance stacks. Through its expanded partnership with Thredd, Pliant has successfully mirrored its established European proposition in the U.S., enabling American businesses to issue commercial credit cards that maintain real-time visibility into spend and cash-flow management. The program is live in the U.S. on the Visa network, with bank sponsorship provided by Coastal. The launch follows a successful soft rollout in late 2025, allowing Pliant to begin onboarding U.S. customers while laying the foundation for long-term growth in the market. “This partnership reflects exactly what Thredd is built f

Vasion® is Imprivata®-Ready Certified to Bring Trusted Identity Across Healthcare Print Infrastructure4.8.2026 15:00:00 EEST | Press release

Vasion, a leader in intelligent print automation, today announced a strategic integration with Imprivata, a leading digital identity and access management company for life- and mission-critical industries, starting with healthcare. The Vasion platform, with PrinterLogic®, PrinterLogic Output, and Vasion Automate, offers shared Imprivata customers a unified identity layer, spanning endpoints and printers, for secure, enterprise-wide visibility into every print job. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804404337/en/ The integration is designed to maximize existing Imprivata deployments. No rip-and-replace is required. The Vasion platform works with the Imprivata infrastructure organizations already have in place, extending its value to print without adding new hardware. Print environments remain a blind spot in identity and access management. The stakes are significant. Quocirca's 2025 Print Security Landscape stu

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye