Temenos Recognized as the Only Global Power Seller in the 2020 Deal Survey, With More Than Double the New Named Deals of the Next Banking Platform
4.6.2020 12:30:00 EEST | Business Wire | Press release
Temenos (SIX: TEMN), the banking software company, has been listed as the industry’s only ‘Global Power Seller’ in Forrester’s prestigious Global Banking Platform Deals Survey 2020 with 30% increase in new named deals. Temenos landed more new global banking deals than any other provider in 2019, as stated in the Forrester report. Temenos was also named ‘Top Global Player’ in the survey, based on combined deals, which represent a vendor’s ability to enhance its market position and keep creating value for its existing customers.
Forrester reconfirmed Temenos’ status as a ‘Top Global Player’ for the 8th consecutive year. This ranking recognizes platforms with over 150 combined deals (new names and extended deals with existing customers) in more than five regions. With 177 deals signed with new and existing customers, Temenos maintained its position at the forefront of the table. Temenos also retains its position as a ‘Global Power Seller’, the highest status in the vendor pyramid for new deals. With 78 new business deals in 2019, this marks the 14th consecutive year that Temenos has received this recognition.
Max Chuard, Chief Executive Officer, Temenos, said: “It’s a great honour to be recognized again as a ‘Global Power Seller’ and ‘Top Global Player’ in the Forrester’s Global Banking Platform Deals Survey. The Temenos deal figures are higher than the total of new named signings of the next two vendors combined. We believe that these results are a validation of our relentless investment in innovation, product strength, and customer successes. The COVID-19 pandemic has accelerated the need for digital banking and cloud/SaaS models. For banks to succeed in the ‘new normal’ we firmly believe that they must embark on an end- to- end digital transformation. Only Temenos can offer the winning combination for the most advanced AI and cloud technology and richest banking functionality which helps banks deliver outstanding value to their customers and support them in building sustainable business growth in the future.”
Jost Hoppermann, Vice President and Principal Analyst, Forrester, wrote in the report: “It was true before the COVID-19 outbreak, and it will again move center stage in the days after: The transformation imperative in banking needs imminent execution. A flood of business and regulatory requirements has continued to drive change in the banking industry that in turn changes its face rapidly, albeit still not quickly enough, as there is a growing gap between leaders and laggards. These laggards need to complete digital transformation — in fact, they need to finalize it within the next five to six years at the very latest to avoid dying an analog-business death.”
The Global Banking Platform Deals Survey 2020 is an independent survey conducted annually by Forrester. It assesses both the volume and geographical spread of banking platform sales to new and existing customers for 2019 deals. The research is used by decision-makers at financial institutions around the world looking to effectively evaluate the plethora of banking software solutions available.
Temenos was most recently recognized as a leader in ‘The Forrester Wave™: Digital Banking Engagement Platforms, Q3 2019’, and previously in ‘The Forrester Wave™: Global Digital Banking Platforms, Q3 2018’.
– Ends –
About Temenos
Temenos AG (SIX: TEMN) is the world’s leader in banking software. Over 3,000 banks across the globe, including 41 of the top 50 banks, rely on Temenos to process both the daily transactions and client interactions of more than 500 million banking customers. Temenos offers cloud-native, cloud-agnostic and AI-driven front office, core banking, payments and fund administration software enabling banks to deliver frictionless, omnichannel customer experiences and gain operational excellence.
Temenos software is proven to enable its top-performing clients to achieve cost-income ratios of 26.8% half the industry average and returns on equity of 29%, three times the industry average. These clients also invest 51% of their IT budget on growth and innovation versus maintenance, which is double the industry average, proving the banks’ IT investment is adding tangible value to their business.
For more information, please visit www.temenos.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20200604005285/en/
Contact information
Jessica Wolfe & Grace Collins
Temenos Global Public Relations
Tel: +1 610 232 2793 & + 44 20 7423 3969
Email : press@temenos.com
Alistair Kellie & Andrew Adie
Newgate Communications on behalf of Temenos
Tel: +44 20 7680 6550
Email: allnewgatetemenos@newgatecomms.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab23.7.2026 13:19:00 EEST | Press release
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their 10th-generation products. Both generations of 3D flash memory adopt innovative CBA (CMOS directly Bonded to Array)
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 13:02:00 EEST | Press release
VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adjustment and dynamic contrast improvement, and edge enhancement. Together
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 12:11:00 EEST | Press release
Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expertise was instrumental in achieving a successful outcome.” Japan Corpora
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 02:00:00 EEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 02:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stacking 332 layers and improving lateral density
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
