Temenos to Host SCALE Virtual Developer Conference to Shape the Future of Banking
3.11.2020 12:00:00 EET | Business Wire | Press release
Temenos (SIX: TEMN), the banking software company, today announced that registration is open for Temenos SCALE on the 17-18 November 2020. Temenos SCALE is the biggest developer conference in the banking industry, attracting developers from over 106 countries and from every type and size of institution across the banking industry. At Temenos SCALE, this global developer community will experience hands-on workshops, presentations and demonstrations with a focus on Explainable AI, microservices and open APIs and cloud technologies. Register here for this free to attend event.
Paul Roberts, Director, Temenos Developer Community & MarketPlace, Temenos, said: “Developers love Temenos because we have the most advanced technology, the richest ecosystem and the largest customer base of the most ambitious and challenger banks. We recognize the vital role our developer community plays in shaping the future of banking and we are committed to developers’ success. We invest an industry leading 20 per cent of our revenues into research and development – a further $1bn investment over just the next few years. And we are making significant investment in our developers too, supporting them with the tools, skills and knowledge to use our technology to solve real world problems at scale. Our API-first technology and modern microservices-based architecture enables rapid innovation and our MarketPlace gives developers a shop window into banks serving more than one billion people around the world. Banking truly is the most exciting space for developers right now and Temenos SCALE is the flagship event to bring the developer community together, to learn, share and grow.”
Attendees of Temenos SCALE will hear from influential technology and banking industry leaders. Temenos CEO Max Chuard will keynote on why now is a pivotal moment in the banking industry, how developers are shaping the future and making banking a force for good and how Temenos is supporting them with innovative technologies to create and bring new products to market faster.
Banks face mounting pressure as they try to keep pace with evolving customer expectations, competition and changing regulations. Covid-19 has accelerated the shift to digital banking and SaaS; Open Banking regulation is splitting the value chain and proving a catalyst for innovation; and with the rise of big tech, customers now expect seamless, hyper-personalized experiences. These trends are driven and enabled by technology and banks increasingly need developers to help them survive and thrive in this digital-first era.
The Temenos SCALE event will include over 40 sessions, including hands-on workshops and product demonstrations. Attendees will also hear from Temenos’ technology partners and customers. ABN AMRO will share insights on the power of analytics, Openbank on the extensibility of Temenos Transact to differentiate and Canadian Western Bank on design thinking. The event is supported by IBM as the headline sponsor, Microsoft, Red Hat, TailWind, NuoDB and Syncordis,
Andre Tost, Distinguished Engineer and CTO, IBM Cloud Pak Architecture, said: “At Temenos SCALE, you’ll hear about how IBM and our business partner Temenos are working together to bring hybrid cloud solutions to banking, and deliver greater automation, innovation and integration capabilities to our joint clients. I hope you’ll join us as we explore the incredible advances of modern software and API-led technology built with IBM offerings, like LinuxONE and IBM Cloud Paks. We look forward to engaging the brightest minds in the developer community – today’s change leaders – to discuss how we can work together to create powerful change in the banking industry on a global scale.”
Follow #TemenosSCALE on social media for live updates on LinkedIn, Twitter, Facebook and Instagram.
– Ends –
About Temenos
Temenos AG (SIX: TEMN) is the world’s leader in banking software. Over 3,000 banks across the globe, including 41 of the top 50 banks, rely on Temenos to process both the daily transactions and client interactions of more than 500 million banking customers. Temenos offers cloud-native, cloud-agnostic and AI-driven front office, core banking, payments and fund administration software enabling banks to deliver frictionless, omnichannel customer experiences and gain operational excellence.
Temenos software is proven to enable its top-performing clients to achieve cost-income ratios of 26.8% half the industry average and returns on equity of 29%, three times the industry average. These clients also invest 51% of their IT budget on growth and innovation versus maintenance, which is double the industry average, proving the banks’ IT investment is adding tangible value to their business.
For more information, please visit www.temenos.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20201103005032/en/
Contact information
Jessica Wolfe & Scott Rowe
Temenos Global Public Relations
Tel: +1 610 232 2793 & +44 20 7423 3857
Email : press@temenos.com
Alistair Kellie & Andrew Adie
Newgate Communications on behalf of Temenos
Tel: +44 20 7680 6550
Email: allnewgatetemenos@newgatecomms.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab23.7.2026 13:19:00 EEST | Press release
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their 10th-generation products. Both generations of 3D flash memory adopt innovative CBA (CMOS directly Bonded to Array)
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 13:02:00 EEST | Press release
VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adjustment and dynamic contrast improvement, and edge enhancement. Together
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 12:11:00 EEST | Press release
Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expertise was instrumental in achieving a successful outcome.” Japan Corpora
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 02:00:00 EEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 02:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stacking 332 layers and improving lateral density
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom