Business Wire

Toshiba’s New Simulation Technology for Model-Based Development Shortens Verification Times for Automotive Semiconductors by About 90 Percent

21.9.2021 07:50:00 EEST | Business Wire | Press release

Share

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed a model-based development (MBD) simulation technology that shortens verification times for automotive semiconductors by about 90 percent.[1] The technology allows automotive equipment developers to quickly evaluate designs using Toshiba’s automotive semiconductors, helping to shorten development times.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210920005989/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Simulation results with the new technology (Graphic: Business Wire)

As electric vehicles grow in popularity and advanced driver-assistance systems become standard, automotive equipment is growing increasingly advanced and complicated. Model-based development, a development methodology that uses software to simulate models and evaluate performance in real-time, is helping product developers to refine complex design processes. In the automobile industry, MBD contributes to development advances by simultaneously progressing design and verification prior to making prototypes.

MBD separates functions into blocks and verifies total vehicle behavior by connecting each block. Detailed simulation models that include the behavior of semiconductors in individual blocks are required to verify heat and electromagnetic interference (EMI), essential parameters for assessing the performance of automotive equipment. However, as models become more detailed and precise, verification times are growing longer.

Toshiba took a long hard look at its current evaluation and verification technology for automotive equipment. Sub-systems like electric power steering comprise semiconductor-based electronic circuits that work in microseconds along with mechanical components, gears and shafts, that work in milliseconds. Toshiba’s current technology simulates the electronic circuits and mechanical components at the same time, on a microsecond basis, but this results in a large number of unnecessary and time-consuming calculations in the mechanical components. The technology is also complicated because it adopts the SPICE model—Simulation Program with Integrated Circuit Emphasis—that defines over 100 parameters for the simulation of semiconductor behavior.

Toshiba’s new modeling technology, “Accu-ROMTM”, separately calculates the electronic circuits and the mechanical components. First it verifies the mechanical components, then simplifies the model for mechanical components and finally verifies the total system, including its electric circuits. This approach eliminates unnecessary calculations. In evaluating the electric circuits, the model automatically generates a Very High speed integrated circuit Hardware Description Language-Analog Mixed Signal (VHDL-AMS) model from the SPICE model. VHDL-AMS model allows the verification range to be limited to essential parameters, such as heat and EMI noise, shortening the verification time. For example, verification of a power steering system with Toshiba’s current technology takes 32 hours 51 minutes, but that falls to 3 hours 27 minutes[1] with the new technology.

Toshiba will use the new technology to promote development of high-heat dissipation and low noise automotive semiconductors, and to provide its customers with a development environment which makes it easier to use Toshiba’s products. In addition to automotive applications, Toshiba will use the new technology in semiconductors for other applications, such as industrial equipment and home appliances.

Notes
[1] Verification times for simulation of three-phase inverter circuits in an automotive electric power steering system during a right turn with a duration of six seconds.

* Accu-ROM™ is a trademark of Toshiba Electronic Device & Storage Corporation.
* All other company names, product names and service names may be trademarks of their respective companies.

About Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage Corporation, a leading supplier of advanced semiconductor and storage solutions, draws on over half a century of experience and innovation to offer customers and business partners outstanding discrete semiconductors, system LSIs and HDD products.
The company's 22,000 employees around the world share a determination to maximize product value, and promote close collaboration with customers in the co-creation of value and new markets. With annual sales now surpassing 710-billion yen (US$6.5 billion), Toshiba Electronic Devices & Storage Corporation looks forward to building and to contributing to a better future for people everywhere.
Find out more at https://toshiba.semicon-storage.com/ap-en/top.html

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Media Inquiries:
Motohiro Ajioka
Corporate Communications & Market Intelligence Group
Business Planning Div.
Toshiba Electronic Devices & Storage Corporation
semicon-NR-mailbox@ml.toshiba.co.jp

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 15:00:00 EEST | Press release

Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combines Gore membrane expertise with Vernay’s advanced valve technology. Battery pack designers have traditionally relied on multiple components to manage pressure equalization, mois

Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 15:00:00 EEST | Press release

Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage unmanned threats. Integrating Echodyne’s precise radar track data extends this capability with persistent airspace positional information, providing earlier awareness and high-confi

Doctors, Public Health Experts and Dental Leaders Call for Oral Health to Become Part of Everyday Health Care12.10.2026 14:34:00 EEST | Press release

Doctors, public-health experts and dental leaders are calling for oral health to be treated as part of overall health. Their message is clear: healthier teeth and gums matter beyond the mouth, and effective daily prevention should become a routine part of health care. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261015403348/en/ Oral health is part of overall health. Leading health experts are calling for oral health to become part of everyday health care, with prevention starting at home through healthier habits and daily care of teeth and gums. The new international consensus goes well beyond dentistry. It brought together experts in periodontology, cardiology, diabetes care, family medicine, public health, social care and health education. Convened by the European Federation of Periodontology (EFP) and the European Association of Dental Public Health (EADPH), the group calls on governments, health systems and health pro

Pacific Defense Launches NEXUS, a Converged C2 and Electromagnetic Warfare Mission System12.10.2026 14:30:00 EEST | Press release

Pacific Defense, a leading provider of open-architecture C5ISR and electronic warfare mission systems, today announced the launch of NEXUS, a Commercial Off-the-Shelf (COTS) mission system that converges command and control, communications, networking, edge computing, and electronic warfare on a common, adaptable architecture. Built on a Modular Open Systems Approach (MOSA) aligned to SOSA™, CMOSS and OpenVPX™, NEXUS enables mission-specific configurations across mobile, fixed-site, maritime, and airborne operations. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012010656/en/ NEXUS converges EW and C5ISR in one, open-architecture system for missions across ground, maritime, and airborne operations. NEXUS brings capabilities traditionally integrated through separate systems onto a common chassis, power, timing, processing, and networking foundation, providing shared infrastructure for C2 and EW mission capabilities. One A

Trading Central Expands UCITS ETF Range to U.S. and Global Equities12.10.2026 14:24:00 EEST | Press release

Trading Central SA ("Trading Central") today announced the launch of two new UCITS ETFs in partnership with HANetf, Europe’s first and leading white-label UCITS ETF and ETC platform. The new funds join the Trading Central Quant Europe 50 Equity UCITS ETF (TCQE), launched on 13 August 2026, bringing the Trading Central Quant ETF range to three. NEW – Trading Central Quant U.S. 50 Equity UCITS ETF (TCQU) | ISIN: IE000M5KXSP3 NEW – Trading Central Quant Global 50 Equity UCITS ETF (TCQW) | ISIN: IE000YM4FP49 Trading Central Quant Europe 50 Equity UCITS ETF (TCQE) | ISIN: IE000DN0XQM1 All three ETFs are available to trade on Euronext Paris, Euronext Milan, Euronext Dublin, the London Stock Exchange, and Börse Frankfurt. J.P. Morgan serves as fund administrator and custodian, while GTX acts as the market maker across these exchanges. This launch marks Trading Central’s continued expansion into investable products, leveraging its proprietary research and data to help brokers grow revenue and

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye