Transphorm’s SuperGaN Gen V FET Delivers World’s Lowest Packaged On-resistance, Targeting Electric Vehicle Applications
2.12.2020 14:00:00 EET | Business Wire | Press release
Transphorm Inc. (OTCQB: TGAN)—a pioneer and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—announced today the sampling of its first Gen V device under its proprietary SuperGaNTM brand. The TP65H015G5WS, Transphorm’s new Gen V device, targets the Electric Vehicle (EV) market and provides industry-leading performance enhancements, ease of designability, and optimized cost structure that is inherent to the SuperGaN device family. Notably, the Company’s Gen V GaN solution offers the world’s lowest packaged on-resistance and delivers a 25% lower power loss over Silicon Carbide (SiC) in a standard TO-247-3 package, strengthening the potential of GaN in the EV power conversion market.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20201202005276/en/
Lowest Rds(on) SuperGaN™ FET in a TO-247 package from Transphorm poised for growth in EV market. (Graphic: Business Wire)
In March 2020, Marelli, one of the world's leading global independent suppliers to the automotive sector, announced a strategic partnership with Transphorm to collaborate on new GaN-based automotive/EV power conversion solutions including On-board Chargers (OBCs), DC-DC Converters and Powertrain Inverters for electric and hybrid vehicles. To date, Marelli has made a $4 million equity investment in Transphorm and has committed to an additional $1 million equity investment in Q1 2021.
Dr. Joachim Fetzer, CEO, Electric Powertrain Marelli, commented, “Transphorm’s demonstration of achieving 10 kilowatts of power from a discrete packaged GaN device in a bridge configuration is further validation of the exciting promise of GaN for electric vehicle converters and inverters. As part of our previously announced partnership, we will continue to evaluate Transphorm’s industry-leading GaN devices and work together in support of a multi-year EV systems product roadmap.”
“We continue to innovate Transphorm’s SuperGaN FET technology, now offering the world’s lowest on-resistance in a standard TO-247-3 package in the market, targeted for electric vehicles and other higher power conversion applications. This allows customers to drive into double digit kilowatts with a single device, continuing to demonstrate GaN’s ability to provide higher performance, lower system cost and higher power density,” said Primit Parikh, COO and Co-founder, Transphorm. “Our Gen V GaN platform is creating new design opportunities for power levels that previously required paralleling, while still offering the greater than 99% efficiency.”
Transphorm’s SuperGaN™ Technology Outperforms Silicon Carbide
The SuperGaN Gen V platform incorporates all the learnings from its Gen IV predecessor, patented reduced packaging inductance technology, ease of designability and drivability (Vth of 4 V for noise immunity), and gate robustness of +/- 20 Vmax along with a simplified and reduced assembly structure. In a recent article published in EEWorld, “Pushing the Boundaries of High Voltage GaN Power Conversion,” the company’s TP65H015G5WS was compared to a similar on-resistance leading-edge SiC MOSFET in a standard TO-247-3 package. The devices were both operated up to 12 kW at 70 kHz in a half bridge synchronous boost converter, resulting in Transphorm’s GaN device demonstrating up to 25% lower losses.
Transphorm has begun sampling the SuperGaN Gen V FET, a 15 mΩ 650 V device, which is unavailable with today’s single chip e-mode GaN technology due to its gate sensitivity. Matching the lowest R available from typical SiC MOSFETs in a discrete package, the solution is capable of driving more than 10 kW depending on the target application, such as EV OBCs and powertrain inverters, power supplies for rack powered data center servers, uninterruptible industrial power applications, and renewable photovoltaic inverters. The TP65H015G5WS will also be available for die level module solutions that enable further paralleling for even higher power. The Company anticipates its Gen V FET device to receive JEDEC qualification in mid-2021 with AEC-Q101 qualification expected thereafter.
About Marelli
MARELLI is one of the world’s leading global independent suppliers to the automotive sector. With a strong and established track record in innovation and manufacturing excellence, our mission is to transform the future of mobility through working with customers and partners to create a safer, greener and better-connected world. With around 60,000 employees worldwide, the MARELLI footprint includes 170 facilities and R&D centers across Asia, the Americas, Europe, and Africa, generating revenues of 13.4 Billion Euro (JPY1,541billion) in 2019.
About Transphorm
Transphorm, Inc., a global leader in the GaN revolution, designs and manufactures high performance and high reliability GaN semiconductors for high voltage power conversion applications. Having one of the largest Power GaN IP portfolios of more than 1,000 owned or licensed patents, Transphorm produces the industry’s first JEDEC and AEC-Q101 qualified high voltage GaN semiconductor devices. The Company’s vertically integrated device business model allows for innovation at every development stage: design, fabrication, device, and application support. Transphorm’s innovations are moving power electronics beyond the limitations of silicon to achieve over 99% efficiency, 40% more power density and 20% lower system cost. Transphorm is headquartered in Goleta, California and has manufacturing operations in Goleta and Aizu, Japan. For more information, please visit www.transphormusa.com. Follow us on Twitter @transphormusa.
The SuperGaN mark is a registered trademark of Transphorm, Inc. All other trademarks are the property of their respective owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20201202005276/en/
Contact information
Transphorm Contact:
Heather Ailara
211 Communications
+1.973.567.6040
heather@211comms.com
Marelli Contacts:
Maurizio Scrignari
maurizio.scrignari@marelli.com
Daniela Di Pietrantonio
daniela.dipietrantonio@marelli.com
Tel.: +39 02 972.27.903
Communication Department, Japan
pr@marelli.com
Tel.: +81-48-660-2161
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
FlightSafety International Receives FAA Approval for Virtual Aircraft Preflight Inspection with Evaluation Mode6.5.2026 17:05:00 EEST | Press release
FlightSafety International Inc., the global leader in aviation training and simulation technology, today announced it has received Federal Aviation Administration (FAA) approval for Virtual Aircraft Preflight Inspection (VAPI) with Evaluation Mode for three aircraft training programs: the Embraer EMB-550, Gulfstream G500/G600, and Citation Latitude. This innovative capability allows pilots in initial training to complete a 3D virtual aircraft preflight inspection while in Training Mode, with the added ability to transition directly into the flight deck, followed by Evaluation Mode, that allows pilots to do their preflight check ride portion. “VAPI represents a meaningful advancement in training innovation,” said David Penney, VP of Safety, Courseware and Regulatory Affairs, FlightSafety International. “By leveraging an immersive 3D environment, it offers pilots a more engaging and practical way to develop aircraft familiarity, strengthen inspection discipline, and better prepare for re
Riskified Unveils Next-Generation AI Suite at Ascend 2026, Empowering Merchants with Unprecedented Visibility and Control Over Ecommerce Risk6.5.2026 16:00:00 EEST | Press release
Riskified (NYSE: RSKD), a global leader in ecommerce fraud and risk intelligence, today announced a major leap forward in its AI platform capabilities, introducing a powerful suite of control and empowerment tools designed to give merchant fraud teams complete visibility into risk patterns and identity behavior, conversational AI-driven insights, and the ability to surgically tailor their risk strategies. The innovation suite was announced onstage at Ascend 2026, Riskified’s premier global summit series, taking place May 4-6, 2026, at the Conrad New York Downtown in Manhattan, NY. With global ecommerce continuing to expand and losses from AI-driven fraud attacks projected to spike, particularly with the rise of agentic commerce, where AI bots may conduct transactions on behalf of consumers, accurate fraud decisions are fundamental, but are no longer enough. Today, more than ever, sophisticated fraud and risk teams need to understand the why behind every transaction and pattern, and req
Twilio’s Next Generation Platform: An Infrastructure Layer for Every Conversation in the Agentic Era6.5.2026 16:00:00 EEST | Press release
Twilio (NYSE: TWLO), the infrastructure for customer engagement in the AI era, kicked off its user conference, SIGNAL, by unveiling its next generation platform capabilities for the agentic era. Generally available today, Conversation Memory, Conversation Orchestrator, Conversation Intelligence, and Agent Connect combine to turn disparate interactions into continuous, intelligent, and personal conversations across humans, agents, and systems. “The agentic era is here. Agents are joining conversations alongside the people they represent, and modern customer engagement requires an infrastructure that serves both equally,” said Khozema Shipchandler, Chief Executive Officer at Twilio. “Twilio’s new platform is the foundational infrastructure layer that makes every conversation persistent, contextual, and actionable – ensuring interactions feel like part of one continuous relationship." An Infrastructure Layer for Every Conversation Every business runs on conversations. Today, however, busi
Vultr, SUSE & Supermicro Debut Unified Cloud-to-Edge Architecture for Global AI Scaling6.5.2026 15:00:00 EEST | Press release
Vultr, the world's largest privately-held cloud infrastructure company, in collaboration with SUSE and Supermicro, today announces a strategic architectural framework designed to solve the complexities of deploying and operating AI workloads across distributed environments. As AI moves closer to the point of data creation - from manufacturing floors to retail storefronts - organizations face significant challenges in latency, cost and operational consistency. This joint initiative provides a seamless, Cloud-to-Edge pipeline that integrates high-performance hardware, localized cloud infrastructure, and unified Kubernetes management. The partnership addresses the reality that sending all data back to a central cloud is no longer viable for real-time AI. The solution breaks down the infrastructure into three critical layers: The Cloud and Near-Edge - Enterprises can deploy regional Kubernetes-based AI clusters closer to their users by leveraging Vultr’s 33 global cloud data center regions
Waiv Enters Collaboration with Daiichi Sankyo to Deliver AI-Derived Biomarkers for ADC Program6.5.2026 15:00:00 EEST | Press release
Waiv, formerly Owkin Dx, a Paris-based company catalyzing AI precision testing, today announced it has entered a collaboration with Daiichi Sankyo (TSE: 4568) to lead digital pathology biomarker discovery for an antibody-drug conjugate (ADC) program. With deep expertise across diverse pathology and multimodal data, and a global data network spanning academic institutions, hospitals, and laboratories, Waiv has a proven track record delivering AI-powered biomarker solutions across the full drug development lifecycle. Under the collaboration, Waiv will apply its end-to-end computational pathology platform to early phase data. This includes tumor microenvironment (TME) analysis across both hematoxylin and eosin (H&E) and immunohistochemistry (IHC) stained samples, as well as biomarker discovery and outcome prediction capabilities aimed at identifying biomarkers of treatment response ahead of next clinical trial phases. Purpose-built AI approach tackles one of pharma's hardest challenges: b
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
