Transphorm’s SuperGaN Gen V FET Delivers World’s Lowest Packaged On-resistance, Targeting Electric Vehicle Applications
2.12.2020 14:00:00 EET | Business Wire | Press release
Transphorm Inc. (OTCQB: TGAN)—a pioneer and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—announced today the sampling of its first Gen V device under its proprietary SuperGaNTM brand. The TP65H015G5WS, Transphorm’s new Gen V device, targets the Electric Vehicle (EV) market and provides industry-leading performance enhancements, ease of designability, and optimized cost structure that is inherent to the SuperGaN device family. Notably, the Company’s Gen V GaN solution offers the world’s lowest packaged on-resistance and delivers a 25% lower power loss over Silicon Carbide (SiC) in a standard TO-247-3 package, strengthening the potential of GaN in the EV power conversion market.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20201202005276/en/
Lowest Rds(on) SuperGaN™ FET in a TO-247 package from Transphorm poised for growth in EV market. (Graphic: Business Wire)
In March 2020, Marelli, one of the world's leading global independent suppliers to the automotive sector, announced a strategic partnership with Transphorm to collaborate on new GaN-based automotive/EV power conversion solutions including On-board Chargers (OBCs), DC-DC Converters and Powertrain Inverters for electric and hybrid vehicles. To date, Marelli has made a $4 million equity investment in Transphorm and has committed to an additional $1 million equity investment in Q1 2021.
Dr. Joachim Fetzer, CEO, Electric Powertrain Marelli, commented, “Transphorm’s demonstration of achieving 10 kilowatts of power from a discrete packaged GaN device in a bridge configuration is further validation of the exciting promise of GaN for electric vehicle converters and inverters. As part of our previously announced partnership, we will continue to evaluate Transphorm’s industry-leading GaN devices and work together in support of a multi-year EV systems product roadmap.”
“We continue to innovate Transphorm’s SuperGaN FET technology, now offering the world’s lowest on-resistance in a standard TO-247-3 package in the market, targeted for electric vehicles and other higher power conversion applications. This allows customers to drive into double digit kilowatts with a single device, continuing to demonstrate GaN’s ability to provide higher performance, lower system cost and higher power density,” said Primit Parikh, COO and Co-founder, Transphorm. “Our Gen V GaN platform is creating new design opportunities for power levels that previously required paralleling, while still offering the greater than 99% efficiency.”
Transphorm’s SuperGaN™ Technology Outperforms Silicon Carbide
The SuperGaN Gen V platform incorporates all the learnings from its Gen IV predecessor, patented reduced packaging inductance technology, ease of designability and drivability (Vth of 4 V for noise immunity), and gate robustness of +/- 20 Vmax along with a simplified and reduced assembly structure. In a recent article published in EEWorld, “Pushing the Boundaries of High Voltage GaN Power Conversion,” the company’s TP65H015G5WS was compared to a similar on-resistance leading-edge SiC MOSFET in a standard TO-247-3 package. The devices were both operated up to 12 kW at 70 kHz in a half bridge synchronous boost converter, resulting in Transphorm’s GaN device demonstrating up to 25% lower losses.
Transphorm has begun sampling the SuperGaN Gen V FET, a 15 mΩ 650 V device, which is unavailable with today’s single chip e-mode GaN technology due to its gate sensitivity. Matching the lowest R available from typical SiC MOSFETs in a discrete package, the solution is capable of driving more than 10 kW depending on the target application, such as EV OBCs and powertrain inverters, power supplies for rack powered data center servers, uninterruptible industrial power applications, and renewable photovoltaic inverters. The TP65H015G5WS will also be available for die level module solutions that enable further paralleling for even higher power. The Company anticipates its Gen V FET device to receive JEDEC qualification in mid-2021 with AEC-Q101 qualification expected thereafter.
About Marelli
MARELLI is one of the world’s leading global independent suppliers to the automotive sector. With a strong and established track record in innovation and manufacturing excellence, our mission is to transform the future of mobility through working with customers and partners to create a safer, greener and better-connected world. With around 60,000 employees worldwide, the MARELLI footprint includes 170 facilities and R&D centers across Asia, the Americas, Europe, and Africa, generating revenues of 13.4 Billion Euro (JPY1,541billion) in 2019.
About Transphorm
Transphorm, Inc., a global leader in the GaN revolution, designs and manufactures high performance and high reliability GaN semiconductors for high voltage power conversion applications. Having one of the largest Power GaN IP portfolios of more than 1,000 owned or licensed patents, Transphorm produces the industry’s first JEDEC and AEC-Q101 qualified high voltage GaN semiconductor devices. The Company’s vertically integrated device business model allows for innovation at every development stage: design, fabrication, device, and application support. Transphorm’s innovations are moving power electronics beyond the limitations of silicon to achieve over 99% efficiency, 40% more power density and 20% lower system cost. Transphorm is headquartered in Goleta, California and has manufacturing operations in Goleta and Aizu, Japan. For more information, please visit www.transphormusa.com. Follow us on Twitter @transphormusa.
The SuperGaN mark is a registered trademark of Transphorm, Inc. All other trademarks are the property of their respective owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20201202005276/en/
Contact information
Transphorm Contact:
Heather Ailara
211 Communications
+1.973.567.6040
heather@211comms.com
Marelli Contacts:
Maurizio Scrignari
maurizio.scrignari@marelli.com
Daniela Di Pietrantonio
daniela.dipietrantonio@marelli.com
Tel.: +39 02 972.27.903
Communication Department, Japan
pr@marelli.com
Tel.: +81-48-660-2161
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
NTT DATA Announces Intent to Acquire WinWire to Scale Enterprise AI Adoption and Accelerate Industry Transformation with Microsoft15.5.2026 19:36:00 EEST | Press release
NTT DATA, a global leader in AI, digital business and IT services, today announced it has signed a definitive agreement to acquire WinWire,an award-winning Microsoft partner specializing in Agentic AI, AI on Azure, data engineering and cloud-native development as foundational capabilities for enterprise AI. The acquisition strengthens NTT DATA’s position as a trusted partner to help organizations move beyond experimentation to operationalize AI at scale. The acquisition further advances NTT DATA’s enterprise AI strategy as demand accelerates for AI-driven, cloud-native transformation. By expanding capabilities across data platforms, agentic AI and modern applications, NTT DATA is sharpening its ability to deliver production-ready AI solutions aligned to industry needs, reinforcing its leadership as Microsoft’s Global System Integrator (GSI) Growth Champion Partner of the Year. Upon closing, WinWire will add more than 1,000 skilled Azure engineers and Microsoft specialists to NTT DATA,
STARTEEPO Invest Announces 5% Stake in Xerox Holdings Corporation15.5.2026 19:15:00 EEST | Press release
STARTEEPO Invest (“STARTEEPO”), an alternative investment fund focused on public equity opportunities, today announced that it has acquired a significant ownership position in Xerox Holdings Corporation (“Xerox” or the “Company”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260515594020/en/ As of the date of this release, STARTEEPO and its affiliates beneficially owns 6.6 million shares of Xerox (excluding options), representing approximately 5.05% of the Company’s outstanding common stock. STARTEEPO has filed a Schedule 13D with the U.S. Securities and Exchange Commission (the “SEC”) providing additional details regarding its investment. Investment Perspective STARTEEPO believes that Xerox represents an interesting investment opportunity supported by a combination of balance sheet initiatives, ongoing operational improvements, and its position within a changing and consolidating industry. In STARTEEPO’s view, the Company
NTT DATA Announces Intent to Acquire WinWire to Scale Enterprise AI Adoption and Accelerate Industry Transformation with Microsoft15.5.2026 17:00:00 EEST | Press release
NTT DATA, a global leader in AI, digital business and IT services, today announced it has signed a definitive agreement to acquire WinWire,an award-winning Microsoft partner specializing in Agentic AI, AI on Azure, data engineering and cloud-native development as foundational capabilities for enterprise AI. The acquisition strengthens NTT DATA’s position as a trusted partner to help organizations move beyond experimentation to operationalize AI at scale. The acquisition further advances NTT DATA’s enterprise AI strategy as demand accelerates for AI-driven, cloud-native transformation. By expanding capabilities across data platforms, agentic AI and modern applications, NTT DATA is sharpening its ability to deliver production-ready AI solutions aligned to industry needs, reinforcing its leadership as Microsoft’s Global System Integrator (GSI) Growth Champion Partner of the Year. Upon closing, WinWire will add more than 1,000 skilled Azure engineers and Microsoft specialists to NTT DATA,
Experian Expands Agent Trust Partner Ecosystem with Akamai to Advance Trusted AI Driven Commerce15.5.2026 16:00:00 EEST | Press release
Experian today announced that Akamai Technologies has joined its growing partner ecosystem, designed to further advance secure, trusted AI driven commerce through the Experian Agent Trust™ framework, alongside partner Skyfire supporting emerging payment innovation. As AI agents begin to search, decide, and transact autonomously, they introduce a fundamental challenge for businesses: how to trust an action when it is no longer directly initiated by a human. Without a verified connection between humans and AI agents, autonomous commerce introduces new risks in fraud, misrepresentation, and unauthorized transactions. Experian Agent Trust is designed to address this challenge by establishing identity, accountability, and trust in agent driven interactions. “Trust, security, and performance must scale alongside the growing role of AI agents in digital commerce,” said Kathleen Peters, Chief Innovation Officer at Experian. “Agentic commerce will not scale without trust. By adding Akamai to ou
The LYCRA Company and Dukane Advance Ultrasonic Bonding for Nonwovens at INDEX™ 2615.5.2026 15:00:00 EEST | Press release
The LYCRA Company, a global leader in innovative and sustainable fiber solutions for the personal care industry, and Dukane, a manufacturer of ultrasonic bonding technologies for the hygiene and nonwovens market, are showcasing their latest co-developed advances in ultrasonic bonding at INDEX™ 26, taking place in Geneva, Switzerland, from May 19–22. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260515514441/en/ Join The LYCRA Company and Dukane at INDEX™ 26 in Geneva, as they showcase their latest advances in ultrasonic bonding for nonwovens, including new LYCRA FUSION™ fiber for personal care that delivers superior snapback. Since 2014, both companies have collaborated to advance ultrasonic bonding solutions that help diaper manufacturers improve product softness, fit, and performance while reducing energy consumption, material waste, and maintenance costs. Ultrasonic bonding creates bonded channels between two layers of n
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
