Business Wire

Tricentis Named a Leader in the 2019 Gartner Magic Quadrant for Software Test Automation for Fifth Year in a Row

2.12.2019 21:32:00 EET | Business Wire | Press release

Share

Tricentis, leader in Continuous Testing and software test automation, today announced that it has been named a Leader in Gartner’s 2019 Magic Quadrant for Software Test Automation* research report for the fifth consecutive year. Tricentis is the only company that has been recognized as a Leader in each of the last five years. Tricentis was positioned furthest to the right on the completeness of vision axis for the third consecutive year.

Complimentary report access: Gartner 2019 Magic Quadrant for Software Test Automation.

Digital Transformation Requires a Deep-Seated Transformation—Beyond Tools

According to Gartner, “Application leaders driving DevOps initiatives require effective test automation to succeed.”*

“Achieving optimized Continuous Testing isn’t as simple as selecting the ‘best’ test automation tool; it’s a journey that requires commitment to change,” explained Tricentis Founder and Chief Product Officer Wolfgang Platz. “At Tricentis, we’ve had the pleasure of guiding hundreds of top enterprises along this journey—in collaboration with many exceptional quality leaders. In our opinion, being recognized as a Leader in software testing is shared equally with our customers and partners. We feel that we would not have been recognized without their continued support and collaboration.”

Additional Recognitions for Tricentis

Tricentis was also was recognized as a March 2019 Gartner Peer Insights Customers’ Choice for Software Test Automation and scored the highest in the 2018 Gartner Critical Capabilities report for Software Test Automation for the Enterprise End-to-End Testing (3.84/5) and Progressive Web Apps/Responsive Web/Native App (3.83/5) Use Cases.

“Over 1600 global organizations have adopted the Tricentis Continuous Testing Platform to accelerate Digital Transformation,” stated Tricentis CEO Sandeep Johri. “In a market that’s dominated by testing tools, our approach to customer success is focused on testing transformation. The reason for Tricentis’ strong growth is that we partner with our customers to transform their testing process—versus just selling them point tools. These leading enterprises are now consistently delivering differentiating customer/user experiences through software while their less advanced competitors are living on borrowed time.”

*Source: Gartner, “Magic Quadrant for Software Test Automation,” Thomas E. Murphy, Joachim Herschmann, Jim Scheibmeir, November 25, 2019

Disclaimer: Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner's research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability or fitness for a particular purpose.

Gartner Peer Insights Customers’ Choice constitute the subjective opinions of individual end-user reviews, ratings, and data applied against a documented methodology; they neither represent the views of, nor constitute an endorsement by, Gartner or its affiliates.

About Tricentis

With the industry's #1 Continuous Testing platform, Tricentis is recognized for reinventing software testing for DevOps. Through agile test management and advanced test automation optimized to support over 150+ technologies, we provide automated insight into the business risks of your software releases--transforming testing from a roadblock to a catalyst for innovation. The result is accelerated software delivery speed, improved cost efficiency, and reduced business risk.

Tricentis is the only vendor to achieve "Leader" status in all three top analyst reports (i.e., the "Triple Crown"). This honor is based on our technical leadership, innovation, and a Global 2000 customer base of 1600+ companies, including global enterprises such as Allianz, ANZ Bank, Cisco, Dolby, Experian, First Data, HSBC, Merck, Office Depot, Samsung, Swiss Re, Starbucks, Telstra, UBS, Vodafone, Whole Foods, and WorldPay. Customers rely on Tricentis to achieve and sustain test automation rates of over 90 percent--increasing risk coverage while accelerating testing to keep pace with Agile and DevOps.

Tricentis has a global presence in Austria, Australia, Belgium, Denmark, Germany, India, Netherlands, Singapore, Switzerland, Poland, United States and the UK. To learn more, visit https://www.tricentis.com or follow us on LinkedIn, Twitter, and Facebook.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Wayne Ariola
w.ariola@tricentis.com
(650) 393-3054

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye