TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum
27.10.2021 02:30:00 EEST | Business Wire | Press release
TSMC (TSE: 2330, NYSE: TSM) today recognized the outstanding support and contributions of 11 EDA, IP, and Cloud Alliance partners with the distinction of OIP Partner of the Year at the TSMC 2021 Open Innovation Platform® (OIP) Ecosystem Forum. The OIP Partner of the Year awards honor TSMC OIP ecosystem partners’ pursuit of excellence in next-generation design enablement over the past year. Their collaborative efforts effectively promote innovation in the semiconductor industry. TSMC announced award winners at its 2021 OIP Ecosystem Forum, a one-of-a-kind event that brings together the semiconductor design ecosystem partners and TSMC customers, providing an ideal platform to discuss the latest technologies and design solutions for HPC, mobile, automotive, and IoT applications.
“Through the industry’s most comprehensive and vibrant ecosystem, TSMC is able to help our customers achieve next-generation silicon design and deliver best possible outcomes with our OIP partners’ collaborative power,” said Dr. L.C. Lu, TSMC Fellow and Vice President of Design and Technology Platform at TSMC. “Congratulations to the winners of TSMC OIP Partner of the Year awards. Your continuous collaboration and effort make us able to be at the forefront of technology development, while enabling our customers to take full advantage of the significant power, performance, and area improvements of TSMC’s advanced technologies to accelerate innovation for their differentiated products.”
TSMC launched the Open Innovation Platform in 2008 to reduce design barriers and promote the speedy implementation of innovation in the semiconductor design community by bringing together the creative thinking of customers and partners. The Company values design ecosystem partners and continues working with them to enable next-generation designs with certified solutions benefiting from TSMC’s latest technologies. The title of OIP Partner of the Year is awarded to partner companies working relentlessly to achieve the highest standards of design, development, and technology implementation.
The partner companies recognized with the 2021 TSMC OIP Partner of the Year awards are as follows:
The IP Alliance award winners
- Analog/Mixed Signal IP: Silicon Creations
- DSP IP: Cadence Design Systems, Inc.
- Embedded Memory IP: eMemory Technology Inc.
- Emerging IP Company: proteanTecs Ltd.
- High-Speed SerDes IP: Alphawave IP
- Interface IP: Synopsys, Inc.
- Processor IP: Arm Ltd.
- Specialty Process IP: M31 Technology
The EDA Alliance award winners
-
Joint Development of 4nm Design Infrastructure:
- ANSYS
- Cadence Design Systems, Inc.
- Siemens EDA
- Synopsys, Inc.
-
Joint Development of 3DFabric™ Design Solution:
- ANSYS
- Cadence Design Systems, Inc.
- Siemens EDA
- Synopsys, Inc.
The Cloud Alliance award winners
-
Joint Development of Cloud-Based Productivity Solution:
- Cadence Design Systems, Inc.
- Microsoft Corp.
- Siemens EDA
About TSMC Open Innovation Platform® (OIP)
TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners under the common goal of shortening design time, time-to-volume, time-to-market and ultimately, time-to-revenue. The TSMC OIP features the most comprehensive design ecosystem alliance programs covering industry-leading EDA, library, IPs, Cloud, and design service partners. TSMC has worked closely with these ecosystem partners ever since the Company was established and continues to expand its libraries and silicon IP portfolio to more than 40,000 IP titles and provides more than 38,000 technology files and over 2,600 process design kits, from 0.5-micron to 3-nanometer, to customers.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information, please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211026006304/en/
Contact information
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
886-3-505-5901
Media:
Nina Kao
Head of Public Relations
886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
nina_kao@tsmc.com
Tiffany Yang
Public Relations
1-408-382-7934
tiffanyy@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Frankfurt Higher Regional Court upholds BESREMi ® arbitral award in favor of AOP Health24.4.2026 19:52:00 EEST | Press release
Today, the Higher Regional Court of Frankfurt upheld the February 20251 partial final ICC arbitral award in favor of AOP Orphan Pharmaceuticals GmbH (“AOP Health”) in its dispute with PharmaEssentia Corp. (“PharmaEssentia”). The ruling confirms the award which found the Taiwanese company to be liable for certain damages. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260424005227/en/ Portrait Dr. Rudolf Widmann, Founder AOP Health Credit: AOP Health/Daniel Ospelt Dr. Rudolf Widmann, one of the two founders of AOP Health, explains: “We very much welcome the Frankfurt Higher Regional Court’s decision that confirms our position. In the interest of our patients, we are dedicated to maintaining stable and sustainable access to BESREMi® and to responsibly navigating future challenges.” The Product in Dispute The conflict centers around BESREMi® (ropeginterferon alfa-2b), a product launched in 2019 and developed by AOP Health into
Compass Pathways Announces FDA Granted NDA Rolling Review Request and Awarded Commissioner's National Priority Voucher24.4.2026 17:37:00 EEST | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation in mental health, today announced the U.S. Food and Drug Administration (FDA) granted Compass NDA rolling review request and selected COMP360, Compass’ proprietary formulation of synthetic psilocybin, for the Commissioner's National Priority Voucher (CNPV) program for treatment-resistant depression (TRD). Companies selected for the voucher program will be entitled to benefits including enhanced communications and a shortened 1-2 month review time following filing of a New Drug Application (NDA), while maintaining FDA’s rigorous safety and efficacy standards. “We are honored and grateful to be selected for the CNPV which is a clear validation of both the urgent unmet need facing millions of people living with treatment resistant depression and the innovative science of COMP360,” said Kabir Nath, Chief Executive Officer of Compass Pathways. “As the most advan
Banma Intelligence and Alipay Launch AI Cockpit Solution Powered by Alipay AI Pay, Enabling Seamless and Secure In-Car Transactions by Voice24.4.2026 17:04:00 EEST | Press release
At the 2026 Beijing International Automotive Exhibition (“Auto China 2026”), OS and AI technology company Banma Intelligence and Alipay today launched a new AI cockpit solution integrating Alipay AI Pay, enabling drivers to complete purchases by voice command directly from their vehicle. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260424618328/en/ Industry-first AI Cockpit Solution with Alipay AI Pay Unveiled “In the past two years, smart cockpits have achieved rapid advances in perception and decision-making,” said Ming Cai, Banma Intelligence Chief Product Officer. “With large models onboard, vehicles can understand user intent and make recommendations. By integrating Alipay AI Pay into our AI cockpit solution, we are removing the last friction point in the in-car smart cockpit experience - drivers simply speak to pay, no phone required.” The new AI cockpit solution initially covers two high-frequency use cases: enterta
Spatial Announces the Release 2026 1.0.1: New Enhancements Across 3D InterOp, Data Prep, Meshing, and 3D Modeling SDKs24.4.2026 16:21:00 EEST | Press release
Spatial Corp., the leading software development kit provider for design, manufacturing and engineering solutions and a subsidiary of Dassault Systèmes, today announced new enhancements across several of its product lines. These updates further strengthen Spatial’s commitment to delivering high-performance solutions that optimize interoperability, data preparation, and advanced modeling workflows. Designed to improve efficiency and robustness across CAD translation, modeling, meshing, and simulation processes, the latest updates introduce expanded format support, enhanced PMI handling, and new capabilities for complex geometry processing. 3D InterOp NX Reader Enhancement for 2D Drawings The NX reader imports 2D drawings as visualization data from NX 2412 and later versions. glTF Writer Supports Draco Compression glTF export incorporates Draco compression for meshes and point-clouds to significantly reduce output file sizes. Enhanced Support for Reading Product Manufacturing Information
Meta Signs Agreement With AWS to Power Agentic AI on AWS Graviton Chips24.4.2026 15:10:00 EEST | Press release
Meta has signed an agreement to deploy AWS Graviton processors at scale. The deal marks a significant expansion of a long-standing partnership between the two companies as Meta builds its next generation of AI. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260424641117/en/ The deployment starts with tens of millions of Graviton cores, with the flexibility to expand as Meta's AI capabilities grow. The deal reflects a shift in how AI infrastructure gets built: while GPUs remain essential for training large models, the rise of agentic AI is creating massive demand for CPU-intensive workloads—real-time reasoning, code generation, search, and orchestrating multi-step tasks. Graviton5 is purpose-built for these workloads, giving Meta the processing power to run them efficiently at scale. The chips will power various workloads at Meta, including supporting the company’s AI efforts. That work requires infrastructure that can handle
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom