TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum
TSMC (TSE: 2330, NYSE: TSM) today recognized the outstanding support and contributions of 11 EDA, IP, and Cloud Alliance partners with the distinction of OIP Partner of the Year at the TSMC 2021 Open Innovation Platform® (OIP) Ecosystem Forum. The OIP Partner of the Year awards honor TSMC OIP ecosystem partners’ pursuit of excellence in next-generation design enablement over the past year. Their collaborative efforts effectively promote innovation in the semiconductor industry. TSMC announced award winners at its 2021 OIP Ecosystem Forum, a one-of-a-kind event that brings together the semiconductor design ecosystem partners and TSMC customers, providing an ideal platform to discuss the latest technologies and design solutions for HPC, mobile, automotive, and IoT applications.
“Through the industry’s most comprehensive and vibrant ecosystem, TSMC is able to help our customers achieve next-generation silicon design and deliver best possible outcomes with our OIP partners’ collaborative power,” said Dr. L.C. Lu, TSMC Fellow and Vice President of Design and Technology Platform at TSMC. “Congratulations to the winners of TSMC OIP Partner of the Year awards. Your continuous collaboration and effort make us able to be at the forefront of technology development, while enabling our customers to take full advantage of the significant power, performance, and area improvements of TSMC’s advanced technologies to accelerate innovation for their differentiated products.”
TSMC launched the Open Innovation Platform in 2008 to reduce design barriers and promote the speedy implementation of innovation in the semiconductor design community by bringing together the creative thinking of customers and partners. The Company values design ecosystem partners and continues working with them to enable next-generation designs with certified solutions benefiting from TSMC’s latest technologies. The title of OIP Partner of the Year is awarded to partner companies working relentlessly to achieve the highest standards of design, development, and technology implementation.
The partner companies recognized with the 2021 TSMC OIP Partner of the Year awards are as follows:
The IP Alliance award winners
- Analog/Mixed Signal IP: Silicon Creations
- DSP IP: Cadence Design Systems, Inc.
- Embedded Memory IP: eMemory Technology Inc.
- Emerging IP Company: proteanTecs Ltd.
- High-Speed SerDes IP: Alphawave IP
- Interface IP: Synopsys, Inc.
- Processor IP: Arm Ltd.
- Specialty Process IP: M31 Technology
The EDA Alliance award winners
-
Joint Development of 4nm Design Infrastructure:
- ANSYS
- Cadence Design Systems, Inc.
- Siemens EDA
- Synopsys, Inc.
-
Joint Development of 3DFabric™ Design Solution:
- ANSYS
- Cadence Design Systems, Inc.
- Siemens EDA
- Synopsys, Inc.
The Cloud Alliance award winners
-
Joint Development of Cloud-Based Productivity Solution:
- Cadence Design Systems, Inc.
- Microsoft Corp.
- Siemens EDA
About TSMC Open Innovation Platform® (OIP)
TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners under the common goal of shortening design time, time-to-volume, time-to-market and ultimately, time-to-revenue. The TSMC OIP features the most comprehensive design ecosystem alliance programs covering industry-leading EDA, library, IPs, Cloud, and design service partners. TSMC has worked closely with these ecosystem partners ever since the Company was established and continues to expand its libraries and silicon IP portfolio to more than 40,000 IP titles and provides more than 38,000 technology files and over 2,600 process design kits, from 0.5-micron to 3-nanometer, to customers.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information, please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211026006304/en/
Contact information
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
886-3-505-5901
Media:
Nina Kao
Head of Public Relations
886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
nina_kao@tsmc.com
Tiffany Yang
Public Relations
1-408-382-7934
tiffanyy@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Ahead of Holiday Season, Visa Identifies Five Transformative Forces Reshaping Global Payment Security20.11.2025 20:50:00 EET | Press release
To celebrate International Fraud Awareness Week, Visa (NYSE: V) today released its Fall 2025 Biannual Threats Report, revealing five forces that are transforming the global payments security landscape. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251120412198/en/ The report, produced by Visa's Payment Ecosystem Risk and Control (PERC) team, draws on intelligence from Visa's global network to identify how criminal operations are evolving with unprecedented speed, scale, and sophistication. "The payments ecosystem is experiencing a paradigm shift in how fraud operates," said Paul Fabara, Chief Risk and Client Services Officer at Visa. "Criminals are no longer working as opportunistic individuals-- they're operating like tech startups, building reusable infrastructure and deploying systematic, industrial-scale operations that challenge conventional defenses. Understanding these evolving forces is critical for the entire ecosy
Suzano Forms Partnership with Tencent and Ecofuturo Institute at COP30 for AI-Powered Conservation and Nature Education20.11.2025 19:25:00 EET | Press release
The world’s largest pulp supplier, Suzano, today announces the signing of a Memorandum of Understanding (MoU) with the multinational technology business Tencent and the Brazilian non-profit Ecofuturo Institute, to pioneer new digital approaches to drive public engagement in conservation. The collaboration will leverage Suzano’s expertise in sustainable forestry, Tencent’s cutting-edge digital technology, and Ecofuturo’s expertise in environmental education, to pilot joint initiatives in both Brazil and China. These include enhancing ecological awareness, accelerating biodiversity solutions, and leveraging digital platforms to foster public engagement in conservation. The partnership will result in a pilot project where advanced AI tools for species recognition developed by Tencent’s Sustainable Social Value organization will be used to identify and monitor native species at Neblinas Park and other conservation areas managed by Ecofuturo. Further initiatives include the development of i
EMVCo Working on How Global Specifications Can Support Agentic Payments20.11.2025 18:38:00 EET | Press release
EMVCo – the technical body that creates and manages EMV® Specifications and programmes that enable seamless and secure card-based payments worldwide – has announced that it is working on how global specifications can support innovation in agentic payment solutions by increasing trust and interoperability across the ecosystem. Agentic commerce is rapidly reshaping the shopping experience by enabling AI agents to act on the consumer’s behalf. This is driving significant momentum for agentic payments, which introduce AI agents as new actors that can initiate transactions with merchants – without requiring direct involvement from the consumer. While agentic payments have the potential to increase convenience and personalisation, they present unique considerations for how transactions are initiated, authenticated and secured. As industry adoption and innovation accelerate, a globally interoperable and scalable approach may be beneficial in realising trusted agentic payments for consumers, m
Andersen Consulting Adds Collaborating Firm Cloud2320.11.2025 16:30:00 EET | Press release
Andersen Consulting enters a Collaboration Agreement with Cloud23, a next-generation consulting firm integrating data and artificial intelligence to drive digital transformation. Located in South Africa, Cloud23 delivers intelligent, platform-based solutions to clients across sectors such as finance, telecom, healthcare, and manufacturing. The firm’s offerings span Salesforce consulting and implementation, managed services, and AI strategy, empowering organizations to modernize customer engagement, optimize operations, and drive measurable outcomes. “Our goal at Cloud23 has always been to simplify transformation through smart, scalable design,” said Ram Ramakrishnan, founder and CEO of Cloud23. “We focus on aligning technology with purpose, delivering outcomes that support long-term growth, customer value, and innovation. Collaborating with Andersen Consulting allows us to amplify our mission and extend the impact of our work across a global platform.” “Cloud23 has achieved impressive
Université Paris-Saclay and Owkin: A Unique Alliance to Propel University Medical Research to the Top of the European Rankings Through AI20.11.2025 16:17:00 EET | Press release
Université Paris-Saclay and Owkin announce the signing of a memorandum of understanding to explore the potential of K Pro Free - Owkin’s AI co-pilot for biology - for use by Paris-Saclay. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251120130113/en/ K Pro Free will now be available to the entire Université Paris-Saclay community, and in particular teachers, researchers and doctoral students working in the biomedical sciences. The partnership includes workshops, training sessions and events designed to promote the discovery and adoption of K Pro Free, as well as the co-organization of communication and dissemination initiatives around the use of AI in health. In this way, the partnership will promote user training, but also enrich and continuously improve the co-pilot's models through feedback and use cases from the l’Université Paris-Saclay community. This partnership is part of Université Paris-Saclay’s strategy to integr
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom