TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A, the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Contact information
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Michael Kramer
Public Relations
Tel: 886-3-563-6688 ext. 7125031
Mobile: 886-988-931-352
E-Mail: pdkramer@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Libraesva and Cyber Guru Announce Strategic Combination to Create a Leading European Human-Centric Cybersecurity Provider27.1.2026 12:00:00 EET | Press release
Cyber Guru and Libraesva today announced a strategic combination that brings together two highly complementary Italian cybersecurity companies to form a new European leader in human-centric cyber protection. The combined group will offer organisations an integrated approach to defending against email-based threats, social engineering, and human-targeted attacks, integrating advanced technology with behavioural resilience. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260127531600/en/ Cyber threats are evolving rapidly, with attackers focusing less on infrastructure and more on the weak link in security – human behaviour. Phishing, business email compromise, smishing, QR-code attacks, social engineering and many other forms of attacks targeting humans continue to be primary breach vectors and are rapidly growing in sophistication with support of widely available AI tools. By integrating Libraesva’s advanced, privacy-first em
Europe’s First Meteorological Infrared Sounder Reveals the Atmosphere in 3D27.1.2026 11:30:00 EET | Press release
The first images from Europe’s pioneering meteorological infrared sounder were unveiled today at the EU Space Conference in Brussels, marking a major advance in the ability to monitor how the atmosphere evolves before and during severe weather. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260127490399/en/ Full Earth disc image from the MTG-S Infrared Sounder showing a surface-temperature-sensitive channel, captured between 12:45 and 15:30 UTC on 15 November 2025. The image distinguishes land and sea surface temperatures as well as cloud-top temperatures, highlighting cloud structures and weather systems. Hot desert regions appear in red, while cold cloud tops are shown in blue. © Image: Data acquired on 15 November 2025 and processed by industrial partners Thales and OHB under the supervision of EUMETSAT and ESA. Visual produced by EUMETSAT. The images were captured by the Infrared Sounder (IRS) flying aboard Meteosat Thir
Clearwater Analytics Embeds AI into Beacon Risk Platform to Accelerate Model Validation and Exposure Analysis27.1.2026 11:00:00 EET | Press release
Clearwater Analytics(NYSE: CWAN), the most comprehensive technology platform for investment management, today announced breakthrough embedded agentic AI capabilities within Beacon by CWAN, its enterprise risk and quantitative analytics platform, enabling risk teams to accelerate model validation, exposure analysis, and decision-making. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260126906084/en/ As regulatory scrutiny intensifies and portfolio complexity reaches unprecedented levels, traditional risk platforms are failing institutional investors when they need answers most. Built specifically for quantitative developers and risk professionals managing complex institutional portfolios, CWAN’s embedded AI operates within Beacon’s calculation engine itself, training the agents our clients deploy on data grounded in a firm’s actual positions, validated models, and real-time calculations. This breakthrough architecture process
Seasoned European Software Executive David Coste to Join Battery Ventures27.1.2026 10:00:00 EET | Press release
Battery Ventures, the global, technology-focused investment firm, announced it has hired former Forterro executive David Coste as an executive-in-residence based in its London office, effective next month. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260127122321/en/ David Coste, a former Forterro executive who begins a new executive-in-residence role with global investment firm Battery Ventures in London in February. At Battery, Coste will work closely with Battery Partner Zak Ewen and General Partner Morad Elhafed, among others, to help source and evaluate business-technology investments throughout Europe. Battery first opened its London office in 2016 and, since 2005, has completed more than 150 transactions across 13 countries including the U.K., Germany, France, the Netherlands, Belgium, Switzerland, Sweden and Norway. “We’re thrilled to have David join our team in London after watching the significant impact he’s had
Castles Technology Partners With Loomis Pay to Power European Expansion With Next-Generation Android Devices27.1.2026 09:00:00 EET | Press release
Castles Technology, a global leader in Android payment acceptance devices, has been selected by Loomis Pay, the POS and digital payment division of Loomis, to support its European expansion. Through this collaboration, Loomis Pay will strengthen its capacity to deliver flexible and secure POS and payment solutions tailored to merchant preferences. As well as empowering merchants and their customers to transact the way they prefer, cash, card and digital. Following an extensive market review, Loomis Pay chose Castles Technology for its leadership in Android-based payment solutions, recognized for versatility, reliability, and innovation across its latest Android devices. Loomis Pay will deploy their POS and payment services on the portable S1F4 Pro, the PINPAD S1P2 and the unattended S1U2M4, as well its CasHUB TMS and Marketplace. Castles Technology and Loomis Pay have been working hand-in-hand with Seitatech, a specialized Finnish payment expert company, to develop the complete softwar
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom