TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A, the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Contact information
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Michael Kramer
Public Relations
Tel: 886-3-563-6688 ext. 7125031
Mobile: 886-988-931-352
E-Mail: pdkramer@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Syngenta to Address Global Agricultural Challenges at WEF, Championing AI to Empower Farmers and Create Open Technology Access19.1.2026 09:00:00 EET | Press release
As farmers globally grapple with unprecedented economic, geopolitical, and environmental pressures; the agricultural sector faces a continued contraction. An alarming decrease in active farms worldwide and rising financial distress underscore the urgent need for innovation and technology to ensure a resilient food system. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260118646017/en/ Jeff Rowe, Syngenta Group CEO "Farmers today are navigating one of the most complex periods in modern agriculture, facing pressures that demand urgent action and real solutions," said Jeff Rowe, CEO of Syngenta Group. "We have a critical window of opportunity to reverse troubling trends by ensuring every farmer, regardless of farm size or technical background, can access the transformative power of AI and digital tools.” “When we combine AI and digital tools with deep agricultural expertise, we unlock genuine potential to revolutionize farming.
KPMG Enters Strategic Relationship With Uniphore to Build AI Agents Powered by Industry-Specific Small Language Models19.1.2026 08:00:00 EET | Press release
Uniphore, the Business AI company, today announced a strategic relationship with KPMG LLP to operationalize AI agents across internal and client-facing workflows, supporting the firm’s continued effort to move from experimental AI pilots to production-grade deployment. As part of the collaboration, KPMG will work with Uniphore to build AI agents using Uniphore’s Business AI Cloud as a platform for agentic AI and fine-tuned small language models (SLMs), supporting clients across regulated industries including banking, insurance, energy and healthcare. Built on a sovereign, composable, and secure architecture, the platform integrates with KPMG’s existing enterprise systems and data environments, meeting governance and compliance requirements essential to regulated industries. This initiative reflects KPMG’s broader effort to equip its global workforce with AI-enabled delivery models, complementing its consulting expertise with AI-embedded execution inside core business processes. “We are
International Chamber of Commerce, Carbon Measures Announce First Group of Global Experts for Carbon Accounting Panel19.1.2026 07:00:00 EET | Press release
The International Chamber of Commerce (ICC) and Carbon Measures today announced the first cohort of experts selected to serve on the Technical Expert Panel on Carbon Accounting, which will define the principles, scope and real-world applications of a carbon emissions accounting system. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260118104674/en/ The panelists are distinguished leaders and experts across industry, science, civil society, and academia – representing diverse disciplines, geographies, and professional backgrounds. The panel will apply their experience across sustainability, technology, public policy, and industrial and financial systems to establish a timely, accurate and verifiable ledger-based carbon emissions accounting system. This system will track product-level emissions across the value chain and support real-world decision-making by companies, standards-setters, and policymakers globally. The first gr
AI-Powered Creator Monetisation Platform, Fanvue, Hits $100m Run Rate and Raises $22m Series A Investment - as Leading Global Creators Rush to Join the Platform19.1.2026 02:01:00 EET | Press release
Fanvue, the AI-powered creator monetisation platform with a $100m-plus run rate, has announced a $22m Series A investment round. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260112458975/en/ Joel Morris, Will Monange and Harry Fitzgerald (left to right) Fanvue has bet big on AI-powered tools changing the face of an industry estimated to be worth over $500B by 2030. The platform, which recently crossed $100m annualised revenue, has over 17 million monthly active users, and is home to 250,000 creators who are using Fanvue’s pioneering AI tools to scale their businesses and earn. Instead of competing with legacy platforms, Fanvue is defining a new category, the Creator AI Economy. Fanvue’s belief is that the next generation of creators will accelerate their earnings through utilising technology. And it’s happening in real time. According to Fanvue, just over 93% of creators on the platform used at least one of the platform’s
ClickHouse Raises $400M Series D Led by Dragoneer to Accelerate Expansion Across Analytics and AI Infrastructure16.1.2026 16:30:00 EET | Press release
ClickHouse, a leader in real-time analytics, data warehousing, observability, and AI/ML, announced today the close of its Series D financing, raising $400 million. The round was led by Dragoneer Investment Group, with participation from Bessemer Venture Partners, GIC, Index Ventures, Khosla Ventures, Lightspeed Venture Partners, accounts advised by T. Rowe Price Associates, Inc., and WCM Investment Management. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260116008883/en/ ClickHouse Co-Founders (left to right): Yury Izrailevsky, Aaron Katz, Alexey Milovidov The financing follows a period of sustained, accelerating growth for ClickHouse. The company now serves more than 3,000 customers on its fully managed service, ClickHouse Cloud, with ARR growing more than 250 percent year over year. Over the past three months, customers including Capital One, Lovable, Decagon, Polymarket, and Airwallex have adopted the platform or expand
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom