TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A, the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Contact information
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Michael Kramer
Public Relations
Tel: 886-3-563-6688 ext. 7125031
Mobile: 886-988-931-352
E-Mail: pdkramer@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Enginzyme and AGC Create Scalable Process for Key mRNA Ingredient12.1.2026 07:00:00 EET | Press release
At the mRNA Health conference in Berlin, enginzyme and AGC Inc. presented a scalable process to produce a key mRNA vaccine and therapy ingredient, N1-methylpseudouridine-5'-triphosphate (m¹ΨTP). The rapid growth of mRNA-based vaccines and therapeutics has driven significant demand for modified nucleotides like m¹ΨTP, which enhances mRNA stability and expression, while reducing immunogenicity. Enginzyme is a deep-tech company delivering optimized biomanufacturing solutions through cell-free enzyme engineering technology. AGC Inc. is a leading global player in fields spanning from architectural glass to chemicals and life science. AGC Inc. provides services in a wide range of life science fields, from synthetic pharmaceuticals and agrochemicals, to biopharmaceuticals and leading-edge cell and gene therapies, as well as messenger RNAs. The presentation in November detailed the latest collaboration between the companies, with a focus on the biomanufacturing of nucleotides for mRNA therapy,
Ant International Partners with Google’s Universal Commerce Protocol to Expand AI Capabilities12.1.2026 03:15:00 EET | Press release
Ant International, a leading global payment, digitisation, and financial technology provider, is collaborating on the launch of Google’s Universal Commerce Protocol (UCP), a new open standard for agentic commerce that works across the entire shopping journey — from discovery and buying to post-purchase support. UCP establishes a common language for agents and systems to operate together across consumer surfaces, businesses, and payment providers to enable commerce. So instead of requiring unique connections for every individual agent, UCP enables all agents to interact easily. UCP is built to work across verticals and is compatible with existing industry protocols like Agent2Agent (A2A), Agent Payments Protocol (AP2), and Model Context Protocol (MCP). “For agentic commerce to scale, it’s critical for the industry to align on a common set of standards. We are proud to have Ant International endorse the Universal Commerce Protocol as the foundation for that future,” said Ashish Gupta, VP
Torq Secures $140M Series D at $1.2B Valuation to Lead the AI SOC and Agentic AI Era11.1.2026 18:59:00 EET | Press release
Torq, the established Agentic AI security operations pioneer, today announced it has closed a massive $140 million Series D funding round, propelling its valuation to $1.2 billion and total funding to $332M. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260112510774/en/ Led by Merlin Ventures—a leading cybersecurity fund renowned for its deep access to the U.S. commercial and Public Sector markets—with participation from all existing investors, including Evolution Equity Partners, Notable Capital, Bessemer Venture Partners, Insight Ventures Partners, and Greenfield Partners, this capital injection is a definitive investment in the future of security. Torq is driving the industry’s critical shift: the complete transformation of the Security Operations Center (SOC) through battle-tested AI Agents at enterprise scale. The new funds will accelerate the adoption of the Torq AI SOC Platform, the only end-to-end solution built on
Biocytogen and Acepodia Expand Collaboration Through Option-based Evaluation Framework for First-in-Class Bispecific and Dual-Payload ADCs (BsAD2C)9.1.2026 14:00:00 EET | Press release
Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, SSE: 688796; HKEX: 02315) and Acepodia (6976:TT), today announced that the companies have entered into an option and license agreement designed to enable the structured evaluation of bispecific antibody-drug conjugate (BsADC) programs to further advance the development of dual-payload bispecific antibody-drug conjugates (BsAD2Cs). The agreement grants Acepodia an option to obtain an exclusive worldwide license from Biocytogen for two BsADC programs. Under the terms of the agreement, Biocytogen is eligible to receive an upfront option fee and, upon Acepodia’s exercise of the option, additional payments including option exercise fees, development, regulatory, and commercial milestone payments, as well as royalties on future product sales. The financial terms of the agreement were not disclosed. “This new agreement builds upon our recent co-development collaboration with Acepodia, which has focused on the evaluation and selection
Blockstream Capital Partners Announces Strategic Acquisition of Derivatives Trading Team from Numeus Group, Leveraging Strategic Partnership with Komainu9.1.2026 12:08:00 EET | Press release
Blockstream Capital Partners (“BCP”) today announced that it has entered into a strategic agreement to acquire a division within Numeus Group’s digital asset trading and investment business. The transaction includes the absorption of select Bitcoin focused trading strategies with a focus on yield generation as well as a ten person derivatives trading team led by Chief Investment Officer Deepak Gulati, a specialist in volatility and derivatives markets. Deepak Gulati, appointed Co-Chief Investment Officer of Blockstream Capital Management alongside Rodrigo Rodriguez, previously served as Global Head of Proprietary Trading at JPMorgan, before founding Argentiere Capital, a multibillion-dollar volatility-focused hedge fund. With a thesis that derivatives would drive Bitcoin and digital asset market maturity, he co-founded Numeus Group in 2021 to develop institutional-grade trading, risk management and market-structure capabilities. Komainu, an existing BCP strategic investment, has played
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom