TSMC Unveils Innovations at 2021 Online Technology Symposium
2.6.2021 02:00:00 EEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A, the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Contact information
TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Michael Kramer
Public Relations
Tel: 886-3-563-6688 ext. 7125031
Mobile: 886-988-931-352
E-Mail: pdkramer@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Ant International Secures Payment Institution Licence from the Central Bank of Brazil4.9.2026 17:41:00 EEST | Press release
Ant International, the leading global digital payment, digitisation, and FinAI solutions provider, today announced that it has received a Payment Institution (PI) licence from the Central Bank of Brazil. “With the Central Bank's invaluable support, we are ready to step up more reliable and comprehensive global payment and account services to enterprises, platforms and SMEs in the country's dynamic digital economy, in ever deeper collaboration with its highly developed payments ecosystem and financial services industry,” said Rodrigo Reif, General Manager, Ant International Brazil. Ant International provides cross-border payments and account services, embedded credit and treasury services, and other finAI and blockchain solutions to clients across Asia, Europe and the Americas. The company processes over 20 million transactions daily, connecting 2 billion consumer accounts to 150 million global merchants via its digital payment ecosystem. The PI licence builds on the services Ant Intern
Bending Spoons completes the acquisition of Airtable4.9.2026 15:30:00 EEST | Press release
Bending Spoons S.p.A. (NASDAQ: BSP) has completed the previously announced acquisition of Airtable, the platform used by more than 500,000 organizations to reshape how teams organize data and manage critical workflows. “Airtable continues to grow because customers value its best-in-class flexibility,” said Luca Ferrari, Bending Spoons CEO and co-founder. “Teams can bring all their data, context, and AI agents together in one place, shape their workflows around their specific needs, and progressively expand their use of the platform over time. As we take the reins, our focus will be on sustaining that growth by investing heavily in Airtable’s product, customer support, and go-to-market capabilities.” “I’m proud of what the Airtable team has built and excited to see the business enter this next chapter,” said Howie Liu, co-founder of Airtable. “I’m confident Bending Spoons has the resources and long-term perspective to help Airtable continue delivering exceptional value to its customers
EQT to acquire McGill and Partners, a leading specialty (re)insurance broker for USD 2.0 billion, from Warburg Pincus4.9.2026 14:48:00 EEST | Press release
EQT and McGill and Partners are pleased to announce that EQT X ("EQT") has entered into a definitive agreement to acquire a majority stake in McGill and Partners from Warburg Pincus for USD 2.0bn. Founder and Chief Executive Officer Steve McGill will continue to lead the firm, while Chairman John Lloyd will remain actively involved. Both will remain as significant shareholders alongside the firm’s wider colleague base, while Warburg Pincus will sell its equity stake in full, marking a successful conclusion to the firms’ partnership. EQT will invest behind McGill and Partners’ ambition to drive accelerated organic growth and global expansion by continuing to attract and support specialty broking talent in key markets, invest further in technology and data capabilities, and expand the firm’s digital solutions – all while maintaining its independence, entrepreneurial culture, and colleague alignment that have been central to its success. The firm was founded in May 2019 by industry titan,
A Race Is Never Won Alone: With La Tavolata, Barilla Brings the Paddock Family Together on the Monza Grid4.9.2026 13:18:00 EEST | Press release
On Thursday evening ahead of the Formula 1® Italian Grand Prix, Barilla transformed one of the sport’s fastest and most competitive environments into a place where the Paddock Family took center stage. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260902463001/en/ La Tavolata by Barilla on the starting grid of the Monza circuit. More than two hundred people gathered around a single table: drivers, Team Principals, mechanics, engineers, strategists, safety and medical car drivers, personal trainers, tire technicians. The individuals whose collaboration, precision and trust shape every race, every decision and every performance. A nearly 100-meter table set with plates and pasta. With the first-ever Tavolata organized by Barilla and F1, people from across the Formula 1® ecosystem – including VCARB driver Yuki Tsunoda and his Race Engineer Alexandre Iliopoulos – celebrated the same principle that defines racing: exceptional pe
Aqara Showcases The New Smart Lighting Series and Immersive Smart Home Experience at IFA 20264.9.2026 12:30:00 EEST | Press release
Aqara, a global leader in IoT, today announced a new lineup of smart lighting products and a global community platform for smart space creators, at IFA 2026 in Berlin. The announcements reflect Aqara's ongoing vision for AI-driven spatial intelligence — spaces that understand their users and adapt to how people actually live in them. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260904365343/en/ Aqara Showcases The New Smart Lighting Series and Immersive Smart Home Experience at IFA 2026 The new lighting series — spanning indoor and outdoor use — integrates seamlessly with Aqara's existing ecosystem of sensors, switches, and hubs, bringing complete whole-space lighting scenarios and automated controls to life. The new Aqara products showcased include the Floor Lamp T1, LED Downlight T2, LED Strip T2, Outdoor String Lights H1, and Permanent Outdoor Lights H1. In addition, the company will present Aqara Builder, a platform fo
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom