Business Wire

TYAN Brings Modern HPC Server Platforms for Data Centers at ISC 2022

27.5.2022 10:00:00 EEST | Business Wire | Press release

Share

TYAN®, an industry-leading server platform design manufacturer and MiTAC Computing Technology Corporation subsidiary, will exhibit its latest HPC platforms powered by 3rd Gen AMD EPYC™ Processors with AMD 3D V-Cache™ technology for data centers deployments at the ISC 2022 event from May 30th to June 1st at booth #D400.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220527005002/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

TYAN’s Server Platforms Powered by AMD EPYC 7003 Series Processors Provide the Best Foundation for Data Centers that Can be Tailored to Specific Workloads (Photo: Business Wire)

“The amount of data generated by humans and machines has increased exponentially and this requires a steady increase of data center compute performance, therefore, modern data centers need balanced hardware to efficiently manage growing data volumes,” said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. “TYAN’s server platforms built upon AMD EPYC™ 7003 Series processors provide the best foundation for datacenters that can be tailored to specific workloads.”

Optimizing for HPC computation and database performance

Powered by 3rd Gen AMD EPYC processors, the Transport HX TN83-B8251 is a 2U dual-socket server with 16 DDR4-3200 DIMM slots and eight 3.5-inch hot-swap SATA or NVMe U.2 tool-less drive bays. The platform supports up to four double-wide GPU cards and two additional low-profile PCIe 4.0 x16 slots that provide optimized topology to improve HPC and deep learning performance.

The Transport CX TN73-B8037-X4S is a 2U multi-node server platform with four front-serviced compute nodes. Each node supports one AMD EPYC 7003 Series processor, four 2.5-inch tool-less NVMe/SATA drive bays, eight DDR4 DIMM slots, three internal cooling fans, two standard PCIe 4.0 x16 expansion slots, two internal NVMe M.2, and one OCP 2.0 LAN mezzanine slot. The platform is suited for high-density data center deployments and targets scale-out applications with large numbers of nodes.

The new Transport EX TE45-B8030 is a 2U edge server platform featuring a single AMD EPYC 7003 Series processor, eight DDR4-3200 DIMM slots and five PCIe 4.0 x16 slots. The platform accommodates six 2.5-inch SATA tool-less drive bays with up to two NVMe U.2 support. The TE45-B8030 can deliver high data throughput and address data acquired at the edge. Inclusion in this exhibit is the M7129-M942-2V network module with two SFP28 25GbE LAN ports that fit into a standard 2.5-inch drive bay.

Taking advantage of AMD EPYC CPU I/O capabilities, the Tomcat HX S8030 server motherboard brings full PCIe 4.0 support in a small ATX (12" x 9.8") form factor. The motherboard provides eight DDR4 DIMM slots, five PCIe 4.0 x16 slots, two SlimSAS 8x connectors for four NVMe, two NVMe M.2 slots, two 10GbE, and two GbE LAN ports.

The Tomcat CX S8253 is a dual-socket AMD EPYC 7003 Series processor-based server motherboard designed for 2U rackmount chassis deployment in EATX (12” x 13.4”) form factor. The motherboard supports 16 DDR4 DIMM slots, three PCIe 4.0 x16 slots, up to 16 SATA ports and two SlimSAS 8x connectors for four NVMe deployment.

Join TYAN booth at ISC 2022, booth #D400 or ISC Digital 2022 at: https://bit.ly/3FhIAYO

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

MiTAC Computing Technology Corporation/ Server Infrastructure Business Unit
Fenny Chen
fenny.chen@tyan.com.tw

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Fortegra Appoints Guy House as SVP, Treaty Reinsurance27.10.2026 11:00:00 EET | Press release

The Fortegra Group, Inc. ("Fortegra" or the "Company"), a global specialty insurer and part of DB Insurance Co., Ltd., has appointed Guy House as Senior Vice President, Treaty Reinsurance. In this role, he will lead Fortegra’s treaty reinsurance underwriting strategy from the Company’s UK office. Mr. House brings more than 18 years of London market experience. He has written and bought reinsurance across multiple product lines and tiers, including property, marine, energy, terrorism and aviation. His expertise spans treaty and retrocession reinsurance, direct and facultative (D&F) insurance, exposure management, alongside capital raising and management. Previously, Mr. House was Head of Property at Tamesis Dual, having joined from Markel International where he worked as the Senior Property D&F Underwriter. He is ACII qualified and holds a degree in Economics from Durham University. About Fortegra For more than 45 years, Fortegra, via its subsidiaries, has underwritten risk management s

TetraMem Advances Analog In-Memory Computing with Tapeout of New 12nm AI SoC27.10.2026 10:41:00 EET | Press release

TetraMem, a Silicon Valley-based pioneer in analog in-memory computing (A-IMC), announced the successful tapeout of MLX300, the world’s first 12nm A-IMC system-on-chip (SoC) based on multi-level RRAM technology. The SoC was developed using industry-leading EDA solutions enabled through Synopsys Cloud FlexEDA, and this milestone represents a major step in bringing this architecture toward advanced-node, production-ready computing. “TetraMem’s architecture represents a fundamentally new approach to AI computing by converging memory and compute together,” said Glenn Ge, CEO and Co-founder of TetraMem. “Leveraging Synopsys EDA solutions through Synopsys Cloud have been instrumental in enabling efficient global collaboration and accelerating our path from research innovation to manufacturable silicon.” The MLX300 tapeout follows TetraMem’s recently announced MLX200/MLX200M multi-level RRAM A-IMC SoC implemented on a commercial 22nm process, marking two successful full-mask tapeouts achieved

Exeon Analytics Introduces AgentGuard for Visibility and Threat Detection Across AI Use and Agent Activity27.10.2026 10:30:00 EET | Press release

Exeon Analytics today introduced Exeon.AgentGuard, a new AI security solution designed to give organizations visibility into approved and shadow AI use, autonomous agent activity and the data flows created through connected tools and external services. Building on its expertise in AI-driven behavioral analytics and threat detection, Exeon expands its cybersecurity capabilities to address emerging risks associated with the rapid adoption of agentic AI. Bringing visibility, addressing data leakage and rogue AI agent behavior As enterprises increasingly adopt AI agents, maintaining visibility into their activities becomes critical. Whether operating autonomously or on behalf of employees, organizations need to understand what AI agents are doing, which systems and data they access, and how they interact with external services. Exeon.AgentGuard provides security teams with visibility into AI agent activities by leveraging existing data sources, without requiring additional agents or comple

Former Nokia Technologies C-suite Executive Joins Sisvel to Lead Creation of New Ventures Unit27.10.2026 10:04:00 EET | Press release

Stavros Kyris has joined Sisvel to lead the formation of Sisvel Ventures, which has a wide-ranging remit to explore opportunities outside of Sisvel’s core areas of business. Kyris previously held a number of senior roles at Nokia and from 2019 until earlier this year was Chief Strategy, Financial and Operating Officer of Nokia Technologies. Before that, he spent five years as Chief of Staff to Nokia’s CEO, having formerly worked in corporate business development, strategy and M&A at the company. Sisvel Ventures will identify and develop IP-based business projects that do not sit within Sisvel’s established standard essential patent (SEP) pool licensing operation. It will draw on expertise within the broader company while functioning separately from it. Senior Sisvel executives Matteo Sabattini and Leonardo Saroni will join Kyris in building the new unit. “Sisvel Ventures is an exciting endeavour that I am delighted to help launch,” says Kyris. “Sisvel has a reputation for its bold, ent

Institutional Investors and Wealth Advisors Remain Bullish on Private Markets, With a Sharpened Focus on Liquidity: New Report From BBH Investor Services27.10.2026 10:00:00 EET | Press release

Private markets are growing in importance to investors’ overall portfolios, according to new research from Brown Brothers Harriman (BBH) Investor Services today. In BBH’s second annual Private Markets Investor Survey, over a quarter of investors say more than 30% of their investments will be allocated to private markets strategies in the next five years. Most investors (84%) plan to increase their private markets investments within the next two years, with private equity ranking as the top target for new investment (54%), up 16 points from last year, followed by private credit (44%), up 20 points year-over-year. The survey captures the views of 500 institutional investors and wealth advisors in the United States, the United Kingdom, Germany, Switzerland, and Japan. Liquidity emerges as a top priority for investors in this year’s report. Investors signaled that their preferred window for capital deployment in private markets is four to six years, followed by preference for an even short

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye