TYAN Introduces HPC, Cloud and Storage Server Platforms Featuring 4th Gen AMD EPYC™ Processors at SC22
15.11.2022 18:00:00 EET | Business Wire | Press release
TYAN®, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, brings the latest HPC, cloud and storage platforms powered by AMD EPYC™ 9004 Series processors for the next generation server architecture and energy efficiency at SC22, Booth #2000 in the Kay Bailey Hutchison Convention Center Dallas through November 17th.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20221115005027/en/
TYAN Server Platforms Powered by AMD EPYC 9004 Series Processors are Designed for the Next Generation Server Architecture (Photo: Business Wire)
“Facing the post-COVID economy world, data centers are required to build on more environmentally friendly, secure and flexible features to respond to the growing of teleworking, video streaming, IoT and 5G,” said Danny Hsu, Vice President of MiTAC Computing Technology Corporation’s Server Infrastructure BU. “TYAN’s new server platforms, powered by 4th Gen AMD EPYC processors, efficiently enable data centers by doing more tasks with the same number of servers.”
"4th Gen AMD EPYC processors are the world's highest performance server CPUs that deliver leadership energy efficiency as well as low total cost of ownership across workloads and industries. By adopting 4th Gen AMD EPYC processors, enterprises can optimize their data center footprint to do more with less, accelerating their core business while helping address their sustainability goals," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD.
Optimized for the most demanding workloads in today’s HPC data centers
Leveraging 4th Gen AMD EPYC processors’ support for high performance DDR5 memory and fast PCIe® Gen 5 I/O, TYAN’s HPC platforms enable the high performance demands of today’s AI and machine learning applications. The Tomcat HX S8050 server motherboard provides eight DDR5 DIMM slots, five PCIe 5.0 x16 slots, four MCIO connectors, two NVMe M.2 slots, two 10GbE and two GbE onboard Ethernet ports in CEB (12" x 10.5") form factor.
The Transport HX FT65T-B8050 is a rack-convertible pedestal server platform featuring a single AMD EYPC 9004 Series processor, eight DDR5 DIMM slots, eight 3.5” SATA and two 2.5” NVMe U.2 hot-swap, tool-less drive bays. The FT65T-B8050 supports up to two double-wide PCIe 5.0 x16 professional GPUs along with two additional high-speed networking adapters for parallel clustered workloads.
Data cache and high-density with front I/O servers to power the cloud
TYAN’s cloud platforms benefit from the innovations of AMD EPYC 9004 Series processors and are designed for cloud and data analytics applications that help move data faster. The Transport CX GC68A-B8056 is a cost-optimized single-socket server platform featuring 24 DDR5 DIMM slots, a pair of PCIe 5.0 x16 expansion slots, one OCP 3.0 LAN mezzanine slot and two 10GbE onboard Ethernet ports in 1U configuration. The GC68A-B8056 accommodates twelve 2.5” tool-less drive bays supporting NVMe U.2 devices for applications which require outstanding compute cores as well as high performance storage I/Os.
The Transport CX TD76-B8058 is a 2U multi-node server platform with four front-service nodes. Each node supports one AMD EPYC 9004 Series processor, 16 DDR5 DIMM slots, four hot-swap E1.S drive bays, two internal NVMe M.2 slots, one standard PCIe 5.0 x16 expansion, and one OCP 3.0 LAN mezzanine slot. The platform is suited for high-density data center deployment, front-end web servers, and variety of scale-out applications with large numbers of nodes.
Hybrid and all-flash storage server to maximize application performance
TYAN’s storage platforms are designed to deliver massive data I/O between memory and storage devices for cloud applications. TYAN's Transport SX TS70-B8056 and Transport SX TS70A-B8056 are 2U single-socket storage servers with support for 24 DDR5 DIMM slots, three PCIe 5.0 and one OCP 3.0 LAN mezzanine slots. The TS70-B8056 accommodates twelve front 3.5” drive bays with up to four NVMe U.2 support, and two rear 2.5” NVMe U.2 hot-swap, tool-less drive bays for boot drive deployment; the TS70A-B8056 offers 26 2.5” NVMe U.2 hot-swap, tool-less drive bays for high IOPs requirement in high-performance data streaming applications.
Supporting Resources:
Please watch this video about TYAN 4th Gen AMD EPYC processor-based servers designed for modern data centers.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20221115005027/en/
Contact information
MiTAC Computing Technology Corporation/ Server Infrastructure Business Unit
Fenny Chen
fenny.chen@tyan.com.tw
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
David Hagan, Dean and Pegasus Professor at CREOL, The College of Optics and Photonics, Will Serve as Vice President of SPIE26.8.2026 06:00:00 EEST | Press release
David Hagan has been elected to serve as the 2027 Vice President of SPIE, the international society for optics and photonics. He will serve as President-Elect in 2028, and as the Society’s President in 2029. The SPIE Board of Directors is influential in the scientific community, establishing policy and strategy and conducting activities of interest to SPIE Members. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825934622/en/ Top row, from left to right: David Hagan, Jim McNally, Mark Clampin. Bottom row, from left to right: Marla Dowell, Jana Kainerstorfer, Katie Schwertz The 2026 SPIE President, Julie Bentley, professor of optics at the University of Rochester, made the new electees announcement at the Annual General Meeting of the Society on 25 August during SPIE Optics + Photonics. Terms begin on 1 January 2027. In addition to his work at CREOL (University of Florida, USA), Hagan has been an SPIE Fellow since 2017.His
FORTÉ Acquires Vega Global, APAC's Largest Systems Integrator, Expanding Global Reach26.8.2026 04:00:00 EEST | Press release
FORTÉ, the leader in communication and collaboration solutions designed for the modern workplace, today announced its acquisition of Vega Global, APAC’s largest systems integrator and a leading provider of workplace technology and audiovisual solutions serving corporate, education, government and other market segments. With this acquisition, FORTÉ adds to its international presence, including established office locations in Hong Kong, Mainland China, India, Japan, Taiwan, Thailand, Singapore, Korea, Vietnam, Australia, Philippines, Malaysia, Macau, New Zealand, Indonesia, and United Arab Emirates. With its headquarters in Minneapolis, Minn., FORTÉ also has operations in the U.S., Ireland, Germany, Sweden, the United Kingdom, and Mexico. “Multinational organizations need strategic partners who can deliver consistent communication and collaboration experiences wherever their people work and do business,” said Jeff Stoebner, Chairman and CEO of FORTÉ. “With Vega Global now part of FORTÉ,
Access Advance Launches Exploration Phase for an AV1/AV2 Device and Software Patent Pool, Invites Participation of Potential Licensors26.8.2026 03:00:00 EEST | Press release
Access Advance LLC announced today that in conjunction with the recent release of the AV2 video codec specification, it has launched the exploratory phase for a new patent pool covering devices and software implementing the AV2 video codec, as well as its predecessor AV1. During this exploratory phase, Access Advance will engage with market participants to seek their input, including holding pool formation discussions with potential licensors to gather their feedback on the scope, structure, and terms of a prospective program. All patent owners with a good-faith belief that they own or control AV1 and/or AV2 essential patents are invited to participate in the pool formation discussions. AV1 adoption is being driven largely by members of the Alliance for Open Media (“AOM”). AOM members such as Google, Meta, and Netflix increasingly utilize AV1 to deliver video, and adoption now spans smart TVs, streaming media players, mobile devices, web browsers, and chipsets. AV2, AOM’s successor to
Lattice to Showcase Industrial FPGA Innovations at FPGAWorld Conference 202625.8.2026 23:00:00 EEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming FPGAWorld Conference 2026, taking place on Sept. 8, 2026, in Stockholm, Sweden. As part of the event, Lattice will deliver technical presentations and host a demo showcase focused on how its low power FPGA solutions are advancing Industrial IoT and sensor bridging applications. Who: Lattice Semiconductor What / When (GMT+2): Tuesday, Sept. 8, 2026 Lattice Demo Showcase Presentations (Track: 12:20 – 13:35, Room Brave 05) “Solving Your Power Puzzle: Lattice FPGAs’ Path to Uncompromised Low Power” “Practical Security Fundamentals for FPGA Engineers” Where: AFRY, Frösundaleden 2A, 169 70 Solna, Sweden The FPGAWorld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational and industrial cases,
France Becomes First Official Participant at Expo 2030 Riyadh25.8.2026 20:40:00 EEST | Press release
France is the first country to officially sign its Participation Contract for Expo 2030 Riyadh, a major milestone in its preparations and growing international momentum. The signing took place on the sidelines of the visit to France by His Royal Highness Prince Mohammed bin Salman bin Abdulaziz Al Saud, Crown Prince and Prime Minister. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825634516/en/ The ceremony in Paris was attended by H.H. Prince Faisal bin Farhan Al Saud, Minister of Foreign Affairs of the Kingdom of Saudi Arabia, and Dimitri S. Kerkentzes, Secretary General of the BIE. The Participation Contract was signed by Talal Al-Marri, Chief Executive Officer of Expo 2030 Riyadh, and Jacques Maire, Chairman of the Compagnie Française des Expositions (COFREX). The agreement formally establishes France’s participation in Expo 2030 Riyadh, providing the framework for its presence throughout the six-month event. It spec
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
