XPeng to Join Hang Seng Composite Index
8.7.2021 19:37:00 EEST | Business Wire | Press release
XPeng Inc. (“XPeng” or the “Company”) (NYSE: XPEV, HKEX: 9868.HK), a leading Chinese smart electric vehicle (“Smart EV”) company, will be added to Hang Seng Composite Index after market close on 20 July 2021.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210708005749/en/
XPeng P7 in Hong Kong (Photo: Business Wire)
Hang Seng Indexes Company Limited announced on 8 July 2021 that XPeng Inc. meets the Fast Entry Rule of various indexes, and will be added to the Hang Seng Composite Index after market close on 20 July 2021. All changes will come into effect on 21 July 2021.
XPeng will also be added to the Hang Seng Composite Industry Index - Consumer Discretionary, as well as the Hang Seng Composite LargeCap Index, the Hang Seng Composite LargeCap & MidCap Index, and the Hang Seng Consumer Goods & Services Index.
The Company’s shares began trading on the Main Board of The Stock Exchange of Hong Kong Limited (HKEX) on July 7, 2021 under the stock code “9868”. XPeng’s HKEX-listed shares will be fully fungible with the Company’s American depositary shares on the New York Stock Exchange (NYSE).
XPeng’s listing on the HKEX marks an important milestone for the Company and the electric vehicle sector. Now XPeng is the world’s first Smart EV company listed on both the NYSE and HKEX, two of the leading stock exchanges in the world, constituting the first dual-primary listing of a Chinese company on the HKEX since July 2018.
“As a front runner in China’s Smart EV industry, we are delighted to be included in the Hang Seng Composite Index,” said Dr. Brian Gu, XPeng Vice Chairman and President. “Inclusion in the Hang Seng Composite Index and the primary listing status in Hong Kong are the key requirements for the Stock Connect scheme.”
This dual-primary listing not only broadens the Company’s access to capital, diversifying its investor base, but also fulfills its long-term strategic objective to be listed in its home region, with direct access to China-based investors, who are likely to be XPeng’s customers. The Stock Connect scheme is the landmark mutual market access programme linking the Hong Kong and Mainland China equity markets.
“We will focus on our strategic roadmap to achieve sustainable growth and maximize shareholder value in the long term,” Dr. Gu added.
About XPeng Inc.
XPeng is a leading Chinese smart electric vehicle company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers in China. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack autonomous driving technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrification/electronic architecture. XPeng is headquartered in Guangzhou, China, with offices in Beijing, Shanghai, Silicon Valley and San Diego. The Company’s Smart EVs are manufactured at plants in Zhaoqing and Zhengzhou, located in Guangdong and Henan provinces, respectively. For more information, please visit https://en.xiaopeng.com.
Follow us on:
Safe Harbor Statement
This announcement contains forward-looking statements. These statements are made under the “safe harbor” provisions of the United States Private Securities Litigation Reform Act of 1995. These forward-looking statements can be identified by terminology such as “will,” “expects,” “anticipates,” “future,” “intends,” “plans,” “believes,” “estimates” and similar statements. Statements that are not historical facts, including statements about XPeng’s beliefs and expectations, are forward-looking statements. Forward-looking statements involve inherent risks and uncertainties. A number of factors could cause actual results to differ materially from those contained in any forward-looking statement, including but not limited to the following: XPeng’s goals and strategies; XPeng’s expansion plans; XPeng’s future business development, financial condition and results of operations; the trends in, and size of, China’s EV market; XPeng’s expectations regarding demand for, and market acceptance of, its products and services; XPeng’s expectations regarding its relationships with customers, contract manufacturers, suppliers, third-party service providers, strategic partners and other stakeholders; general economic and business conditions; and assumptions underlying or related to any of the foregoing. Further information regarding these and other risks is included in XPeng’s filings with the SEC. All information provided in this press release is as of the date of this press release, and XPeng does not undertake any obligation to update any forward-looking statement, except as required under applicable law.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210708005749/en/
Contact information
For Media Enquiries:
Marie Cheung
XPeng Inc.
Tel: +852 9750 5170 / +86 1550 7577 546
Email: mariecheung@xiaopeng.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 16:15:00 EEST | Press release
Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challenge As investment in AI infrastructure accelerates, data center operators face growing pressure to deploy capacity faster than traditional utility infrastructure can support. At the
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 15:30:00 EEST | Press release
HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logistics, one of the world’s most operationally demanding industries, HappyRobot is expanding across the supply chain as well as into insurance, energy and utilit
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 15:30:00 EEST | Press release
Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth compared to the 8th-generation 3D flash memory and becomes the industry’s first QLC 3D flash memory technology to reach a 4.8 Gb/s 3 interface. Add
Thredd and Pliant Expand Partnership to Launch U.S. Commercial Credit Program, Accelerate Embedded Finance for Businesses4.8.2026 15:00:00 EEST | Press release
Thredd, the AI-first issuer processing platform, today announced the expansion of its partnership with Pliant, bringing the company’s commercial credit and embedded finance platform capabilities to the U.S. market for the first time. Pliant provides European businesses with physical and virtual credit cards that have built-in reconciliation, spend controls, and deep integrations into modern finance stacks. Through its expanded partnership with Thredd, Pliant has successfully mirrored its established European proposition in the U.S., enabling American businesses to issue commercial credit cards that maintain real-time visibility into spend and cash-flow management. The program is live in the U.S. on the Visa network, with bank sponsorship provided by Coastal. The launch follows a successful soft rollout in late 2025, allowing Pliant to begin onboarding U.S. customers while laying the foundation for long-term growth in the market. “This partnership reflects exactly what Thredd is built f
Vasion® is Imprivata®-Ready Certified to Bring Trusted Identity Across Healthcare Print Infrastructure4.8.2026 15:00:00 EEST | Press release
Vasion, a leader in intelligent print automation, today announced a strategic integration with Imprivata, a leading digital identity and access management company for life- and mission-critical industries, starting with healthcare. The Vasion platform, with PrinterLogic®, PrinterLogic Output, and Vasion Automate, offers shared Imprivata customers a unified identity layer, spanning endpoints and printers, for secure, enterprise-wide visibility into every print job. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804404337/en/ The integration is designed to maximize existing Imprivata deployments. No rip-and-replace is required. The Vasion platform works with the Imprivata infrastructure organizations already have in place, extending its value to print without adding new hardware. Print environments remain a blind spot in identity and access management. The stakes are significant. Quocirca's 2025 Print Security Landscape stu
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom