TYAN Showcases HPC, AI and Storage Server Platforms Featuring 2nd Gen Intel® Xeon® Scalable Processors at SC19
19.11.2019 17:00:00 EET | Business Wire | Press release
TYAN®, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, exhibits a broad selection of HPC, AI, storage and cloud server platforms that are optimized for enterprise and data center markets at SC19 through November 21st, Booth # 1601 in Denver’s Colorado Convention Center.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191119005008/en/
TYAN HPC Server Platforms Boost Performance with 2nd Gen Intel Xeon Scalable Processors for Enterprises and Data Centers (Photo: Business Wire)
“Data is the foundation of the new economy, and how organizations effectively move, store and process will help determine their level of success,” said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's TYAN Business Unit. “By leveraging the 2nd gen Intel® Xeon® Scalable processors, TYAN’s leading portfolio of HPC, storage and cloud server platforms enable to help our customers accelerate innovation, drive business value, and bring products and services to market faster.”
TYAN HPC and Storage Server Platforms Boost Performance with 2nd Gen Intel Xeon Scalable Processors
TYAN’s HPC server platforms are built on the 2nd gen Intel Xeon Scalable processors with the addition of Intel® Deep Learning Boost technology and Intel® Optane™ DC persistent memory that enable to deliver higher performance for a range of HPC and AI applications. The new Thunder HX FT83-B7119 features high CPU-to-GPU bandwidth for various parallel workloads. The 4U system supports 10 double-width PCIe x16 slots for GPU deployment, a single-wide x16 networking card, up to 3TB of system RAM, and its front-loading 24 hot-swap, tool-less 3.5” drive bays enable easy access with simple, tool-free installation.
More HPC platforms on display include, Thunder HX FT77D-B7109 in a 4U two-socket design with integrated Intel® Omni-Path100 gigabit networking fabric for massively parallel workloads such as scientific computing and large-scale facial recognition; Thunder HX FT48T-B7105 in a 4U pedestal workstation design delivering maximum I/O to professional power users for 3D rendering and image processing; Thunder HX GA88-B5631 with high density and performance in a 1U single-socket chassis supporting 12 DIMM slots and 5 PCIe x16 slots for machine learning and artificial intelligence applications.
Powered by 2nd gen Intel Xeon Scalable processors, TYAN storage platforms offer a variety of tiered storage implementation scenarios for data centers and enterprises across a range of Thunder SX FA100-B7118, a 4U 100-bay high-capacity cold storage, Thunder SX TN76-B7102, a 2U server storage with 24 DDR4 DIMM slots and twelve 3.5” hot-swap drive bays for data virtualization and in-memory databases, and the Thunder SX GT62H-B7106, a 1U high-performance all-flash storage with 10 U.2 NVMe drive bays for extremely high speed data streaming applications.
The new Thunder SX GT90-B7113 is a 1U dual-socket high-density storage platform supporting twelve 3.5” hot-swap SATA drives (SAS drives are supported by configuration). mounted to a service drawer and four 2.5” hot-swap NVMe U.2 drive bays in a 35” chassis depth. The platform is designed for CSP server-based software-defined storage applications by allowing serviceability and density within the same server.
TYAN also showcases entry server platforms highlighting Intel® Xeon® E-2200 processors to offer professional-grade performance. The Thunder CX GT24E-B5556 is a 1U server optimized for cost-effective cloud gaming applications with support for up to 4 DDR4 DIMM slots, 1 double-width GPU card, and dual 10GBase-T Ethernet ports; the Thunder CX GX38-B5550 is a 1U compact sever with sub-400mm deep chassis and support for two 3.5" internal SATA drive bays for edge computing.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20191119005008/en/
Contact information
MiTAC Computing Technology Corporation/ TYAN Business Unit
Fenny Chen
fenny.chen@tyan.com.tw
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
HAZAMA ANDO Becomes an Official Partner in Helical Fusion’s Commercial Fusion Initiative and Signs MoU Toward Construction of the Fusion Pilot Plant6.7.2026 09:40:00 EEST | Press release
Helical Fusion Co., Ltd. (“Helical Fusion”), a Japan-based fusion energy startup developing fusion power plants, and HAZAMA ANDO CORPORATION (“HAZAMA ANDO”), a long-established Japanese general contractor, today announced that HAZAMA ANDO has become an Official Partner in the Helix Program, Helical Fusion’s commercial fusion initiative. The two companies have also signed a memorandum of understanding (“MoU”) to collaborate toward the construction of Helix KANATA, Helical Fusion’s Fusion Pilot Plant targeted for the 2030s. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260706176052/en/ (L-R) Kazuhiko Kuniya (Representative Director and President, HAZAMA ANDO CORPORATION) and Takaya Taguchi (Co-Founder and CEO, Helical Fusion Co., Ltd.) at a press conference in Tokyo on July 6, 2026. Fusion energy has the potential to shift the foundation of energy from natural resources to advanced technology by reproducing, on Earth, the sam
Sofinnova Partners Announces Myricx Bio Agrees to Be Acquired by Novartis6.7.2026 08:15:00 EEST | Press release
Sofinnova Partners, a leading European life sciences venture capital firm, today announced that its portfolio company Myricx Bio (“Myricx”) has reached agreement to be acquired by Novartis, for up to $1.5 billion including $1.1 billion cash upfront plus potential milestone payments. This marks Sofinnova Partners' seventh exit in three years. Myricx Bio is a UK-headquartered transatlantic biotech company focused on the discovery and development of a novel class of payloads for antibody-drug conjugates. The company's platform is built around next-generation N-myristoyltransferase inhibitor (NMTi) payloads, a differentiated mechanism of action designed to address the narrow therapeutic windows and tolerability challenges that have limited earlier generations of ADCs, such as TOPO-1 and tubulin inhibitor payload classes. Myricx Bio's two lead ADC assets, directed towards the established targets B7-H3 and HER2, are designed to bring this differentiated approach to patients across a broad ra
Global New Material International Wins Technology Innovation Best Practice Award at Sino-European ESG Conference6.7.2026 06:59:00 EEST | Press release
Global New Material International Holdings Ltd. has received the Technology Innovation Best Practice Award at the Third Sino-European Corporate ESG Best Practice Conference recently in Mainz, Germany, in recognition of its efforts to advance sustainable development through material innovation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260705533555/en/ Thorsten Giehler (L), Director of the Economic, Social Development and Employment Division of The German Society for International Cooperation (GIZ), delivered the award to Zhou Fangchao, Executive Director and Vice President of Global New Material International. The annual conference, initiated by the Chinese Consulate General in Frankfurt and jointly organized with Chinese and European partners, recognizes corporate best practices in environmental, social and governance (ESG) performance. This year's event brought together government officials, business leaders and exper
Access Advance Welcomes Samsung and Sharp to the VVC Advance Patent Pool6.7.2026 03:00:00 EEST | Press release
Access Advance LLC today announced significant additions to the VVC Advance Patent Pool, including Samsung Electronics and Sharp Corporation joining as both Licensors and Licensees. The additions strengthen Access Advance's position in VVC licensing, bringing two of the world's largest video codec patent holders into the program on both sides of the license. "The growth we are seeing in VVC Advance reflects the broad range of industries and companies that are moving toward VVC as the next standard for video delivery," said Peter Moller, CEO of Access Advance. "Samsung and Sharp joining as both Licensors and Licensees is significant, but so is the participation of leading smartphone brands and the range of consumer electronics and technology companies now executing licenses. We are building a program that reflects where the video market is actually heading." The following companies have joined the VVC Advance Patent Pool as Licensees since the beginning of 2026: American Future Technolo
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab23.7.2026 13:19:00 EEST | Press release
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their 10th-generation products. Both generations of 3D flash memory adopt innovative CBA (CMOS directly Bonded to Array)
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
